Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

Patent metadata

Field	Value
Publication number	US-10998217-B2
Application number	US-201815900178-A
Country	US
Kind code	B2
Filing date	Feb 20, 2018
Priority date	Mar 25, 2015
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

First claim

What is claimed is:

1. A method for forming a semiconductor device comprising:
bonding a semiconductor containing device substrate to a semiconductor containing handler substrate at a bonded interface through a phenoxy resin bilayer including a debonding layer of phenoxy resin with an infra-red (IR) light wave absorbing filler of carbon black and an adhesive layer of phenoxy resin that is substantially free of carbon black, wherein the carbon black within the debonding layer is comprised of aggregates of carbon particles having an aggregate size to match an infra red (IR) light laser absorption value, in which the aggregate size is selected from a range of 85 nm to 500 nm;
processing the semiconductor containing device substrate; and
removing the semiconductor containing device substrate from the semiconductor containing handler substrate using a laser to ablate the phenoxy resin bilayer, the laser having a wavelength selected to match the infra red (IR) light laser absorption value for the aggregate size in order to ablate the phenoxy resin bilayer through localized thermal effects.

2. The method of claim 1 , wherein the absorbing filler of the carbon black is present in the phenoxy resin bilayer in an amount ranging from 1 wt. % to 15 wt. %.

3. The method of claim 1 , wherein the laser is an infra red (IR) laser.

4. The method of claim 3 , wherein the IR laser is selected from the group consisting of Nd:YAG (neodymium-doped yttrium aluminium garnet; Nd:Y 3 Al 5 O 12 ) lasers, helium neon (HeNe) lasers, krypton laser, carbon dioxide (CO 2 ) laser, carbon monoxide (CO) laser and combinations thereof.

5. The method of claim 1 , wherein the semiconductor containing handler substrate is comprised of a material selected from the group consisting of silicon, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, amorphous silicon, strained silicon, silicon doped with carbon (Si:C), silicon alloys, silicon germanium, and combinations thereof.

6. The method of claim 1 , wherein the semiconductor containing device substrate is comprised of silicon, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, amorphous silicon, strained silicon, silicon doped with carbon (Si:C), silicon alloys, silicon germanium, or any combination thereof.

7. The method of claim 1 , wherein the processing is patterning of the semiconductor containing device substrate.

8. The method of claim 1 , wherein the processing is etching of the semiconductor containing device substrate.

9. The method of claim 1 , wherein the processing is thinning of the semiconductor containing device substrate.

10. The method of claim 1 , further comprising removing residues of the phenoxy resin bilayer with a solvent selected from the group consisting of gamma-butyrolactone, ethyl lactate, other lactate isomers, NMP, Tetrahydrofuran (THF), PMAcetate, Methyl isobutyl ketone (MIBK), Methyl ethyl ketone (MEK) or combinations thereof.

11. A method for forming a semiconductor device comprising:
applying processing to a silicon containing device substrate, the silicon containing device substrate and a handler substrate connected by a phenoxyl resin bilayer including a filler of carbon black and an adhesive layer of phenoxy resin that is substantially free of carbon black, wherein the carbon black is comprised of aggregates of carbon particles having a aggregate size to match an infra red (IR) light laser absorption value, in which the aggregate size is selected from a range of that ranges from 85 nm to 500 nm; and
using an infra-red (IR) laser to ablate the phenoxyl resin layer, wherein ablating the phenoxyl resin layer separates the silicon containing device substrate and the handler substrate, the infra-red (IR) laser having a wavelength selected to match the infra red (IR) light laser absorption value for the aggregate size in order to ablate the phenoxy resin layer through localized thermal effects.

12. The method of claim 11 , wherein the filler of the carbon black is present in the phenoxyl bonding layer in an amount ranging from 1 wt. % to 15 wt. %.

13. The method of claim 11 , wherein the IR laser is selected from the group consisting of Nd:YAG (neodymium-doped yttrium aluminum garnet; Nd:Y 3 Al 5 O 12 ) lasers, helium neon (HeNe) lasers, krypton laser, carbon dioxide (CO 2 ) laser, carbon monoxide (CO) laser and combination thereof.

14. The method of claim 11 , wherein the silicon containing handler substrate is comprised of silicon, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, amorphous silicon, strained silicon, silicon doped with carbon (Si:C), silicon alloys, silicon germanium, or any combination thereof.

15. The method of claim 11 , wherein the silicon containing device substrate is comprised of silicon, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, amorphous silicon, strained silicon, silicon doped with carbon (Si:C), silicon alloys, silicon germanium, or any combination thereof.

16. The method of claim 11 , further comprising removing residues of the phenoxy resin layer with a solvent selected from the group consisting of gamma-butyrolactone, ethyl lactate, lactate isomers, NMP, Tetrahydrofuran (THF), PMAcetate, Methyl isobutyl ketone (MIBK), Methyl ethyl ketone (MEK), and combinations thereof.

17. The method of claim 11 , wherein the processing is patterning of the semiconductor containing device substrate.

18. The method of claim 11 , wherein the processing is etching of the semiconductor containing device substrate.

19. The method of claim 11 , wherein the processing is thinning of the semiconductor containing device substrate.

Assignees

• IBM

Inventors

• Dang Bing
• Gelorme Jeffrey D
• Knickerbocker John U

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title