Integrated electro-optical module assembly

Patent metadata

Field	Value
Publication number	US-10670656-B2
Application number	US-201715452933-A
Country	US
Kind code	B2
Filing date	Mar 8, 2017
Priority date	May 9, 2016
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

First claim

What is claimed is:

1. An electro-optical module assembly comprising:
a flexible substrate composed of a flexible plastic material and having a first surface and a second surface opposite the first surface, wherein the flexible substrate is ring-shaped and contains an opening located therein that extends from the first surface to the second surface, wherein the ring-shaped flexible substrate has an outer wall having an outer diameter and an inner wall having an inner diameter, and wherein the inner diameter is less than the outer diameter, and the inner diameter is defined by a dimension of the opening;
an optical component having a first surface portion located on, and entirely beneath, the second surface of the flexible substrate and the optical component is positioned to have a second surface portion, which is laterally adjacent to the first surface portion, exposed by the opening;
at least one electronic component located entirely on a first portion of the first surface of the flexible substrate; and
at least one micro-energy source located entirely on a second portion of the first surface of the flexible substrate.

2. The electro-optical module assembly of claim 1 , wherein the at least one electronic component comprises a first semiconductor die having a first orientation and a second semiconductor die having a second orientation that differs from the first orientation.

3. The electro-optical module assembly of claim 2 , wherein the at least one micro-energy source is a micro-battery.

4. The electro-optical module assembly of claim 3 , wherein the optical component is an optical lens.

5. The electro-optical module assembly of claim 4 , wherein the optical lens is a contact lens.

6. The electro-optical module assembly of claim 1 , wherein the optical component, the at least one electronic component and the at least one micro-energy source are in electrical communication with each other.

7. The electro-optical module assembly of claim 1 , wherein the flexible plastic material comprises a polyimide, a polyether ketone (PEEK) or a transparent conductive polyester.

8. The electro-optical module assembly of claim 1 , wherein the flexible substrate is not flat or planar.

9. The electro-optical module assembly of claim 1 , wherein the at least one electronic component is a semiconductor die or a RF antenna.

10. The electro-optical module assembly of claim 1 , wherein the at least one optical component is a mirror, a lens, a prism, an optical filter, or a light emitting diode.

11. The electro-optical module assembly of claim 1 , wherein the at least one optical component is a lens, and the lens is selected from the group consisting of a camera lens and a contact lens.

12. The electro-optical module assembly of claim 1 , wherein the at least one micro-energy source has a dimension of less than 1,000 microns.

13. The electro-optical module assembly of claim 1 , wherein the at least one micro-energy source is a capacitor or a micro-battery.

Assignees

• IBM

Inventors

• Andry Paul S
• Chen Qianwen
• Dang Bing
• Knickerbocker John U
• Lu Minhua
• Polastre Robert J
• Webb Bucknell C

Classifications

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2203/0169

  Using a temporary frame during processing · CPC title

• Y02P70/613

  Cross-Sectional Technologies · mapped topic

• G01R31/2818

  using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors (G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266) · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title