Package with component connected with carrier via spacer particles
US-11094619-B2 · Aug 17, 2021 · US
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Kalz Franz-Peter patents
Kalz Franz-Peter is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kalz Franz-Peter |
| Total patents | 32 |
| First publication | Feb 3, 2015 |
| Latest publication | Aug 17, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Deposition of protective material at wafer level in front end for early stage particle and moisture protection
US-10858245-B2 · Dec 8, 2020 · US
Semiconductor sensor device and method for fabricating the same
US-10818805-B2 · Oct 27, 2020 · US
Package with component connected with carrier via spacer particles
US-2020043836-A1 · Feb 6, 2020 · US
Package with component connected with carrier via spacer particles
US-10438878-B2 · Oct 8, 2019 · US
Deposition of protective material at wafer level in front end for early stage particle and moisture protection
US-2019300362-A1 · Oct 3, 2019 · US
Deposition of protective material at wafer level in front end for early stage particle and moisture protection
US-10370244-B2 · Aug 6, 2019 · US
Deposition of protective material at wafer level in front end for early stage particle and moisture protection
US-2019161345-A1 · May 30, 2019 · US
Semiconductor device including antistatic die attach material
US-10304795-B2 · May 28, 2019 · US
Semiconductor Sensor Device and Method for Fabricating the Same
US-2019148566-A1 · May 16, 2019 · US
Recent patents
Latest publications not already listed above.
Package with component connected with carrier via spacer particles
US-2018294210-A1 · Oct 11, 2018 · US
Method for manufacturing a chip arrangement including a ceramic layer
US-9984897-B2 · May 29, 2018 · US
Semiconductor device including antistatic die attach material
US-2017352638-A1 · Dec 7, 2017 · US
Micromechanical semiconductor sensing device
US-9790086-B2 · Oct 17, 2017 · US
Semiconductor device including antistatic die attach material
US-2017256515-A1 · Sep 7, 2017 · US
Semiconductor device including antistatic die attach material
US-9741677-B1 · Aug 22, 2017 · US
Sensor device and method
US-9728652-B2 · Aug 8, 2017 · US
Micromechanical semiconductor sensing device
US-9567211-B2 · Feb 14, 2017 · US
Electronic component
US-9559078-B2 · Jan 31, 2017 · US
Chip arrangement and a method for manufacturing a chip arrangement
US-2017004979-A1 · Jan 5, 2017 · US
Micromechanical Semiconductor Sensing Device
US-2017003180-A1 · Jan 5, 2017 · US
Chip package and chip assembly
US-9530754-B2 · Dec 27, 2016 · US
Method for Electrophoretically Depositing a Film on an Electronic Assembly
US-2016240449-A1 · Aug 18, 2016 · US
Method for electrophoretically depositing a film on an electronic assembly
US-9313897-B2 · Apr 12, 2016 · US
Chip package and chip assembly
US-2016035700-A1 · Feb 4, 2016 · US
Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly
US-9159701-B2 · Oct 13, 2015 · US
Micromechanical Semiconductor Sensing Device
US-2015217994-A1 · Aug 6, 2015 · US
Device including two power semiconductor chips and manufacturing thereof
US-9048338-B2 · Jun 2, 2015 · US
Micromechanical semiconductor sensing device
US-9021887-B2 · May 5, 2015 · US
Electronic Component
US-2015111343-A1 · Apr 23, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 32 |
| Kalz Franz-Peter | 5 |
| Hosseini Khalil | 4 |
| Mengel Manfred | 4 |
| Mahler Joachim | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/756 | 17 |
| H10W90/736 | 16 |
| H10W72/073 | 15 |
| H10W90/00 | 13 |
| H10W74/00 | 13 |