Package with component connected with carrier via spacer particles

Patent metadata

Field	Value
Publication number	US-10438878-B2
Application number	US-201815949533-A
Country	US
Kind code	B2
Filing date	Apr 10, 2018
Priority date	Apr 10, 2017
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

First claim

What is claimed is:

1. A package, comprising:
an at least partially electrically conductive carrier;
a passive component mounted on the carrier;
an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component;
wherein the connection structure comprises an at least partially electrically conductive glue in which the spacer particles are embedded;
wherein a spacer material of the spacer particles is polymeric; and
wherein the carrier comprises a planar main surface that includes a first carrier section and a second carrier section that are separated by a recess, wherein the component has a planar main surface that includes a first surface portion and a second surface portion, wherein the first surface portion is electrically connected with the first carrier section by a first portion of the connection structure at least partially between a gap between the first surface portion and the first carrier section and the second surface portion is electrically connected with the second carrier section by a separate second portion of the connection structure at least partially between a gap between the second surface portion and the second carrier section such that the planar main surface of the carrier is opposing and at least substantially parallel with the planar main surface of the component.

2. The package according to claim 1 , comprising at least one of the following features:
wherein the spacer particles have a diameter (D) of at least 10 μm, in particular of at least 30 μm; and
wherein the spacer particles have a diameter (D) of not more than 200 μm.

3. The package according to claim 1 , wherein the spacer particles have a substantially spherical shape.

4. The package according to claim 1 , wherein the at least partially electrically conductive glue is an electrically insulating glue with electrically conductive particles therein.

5. The package according to claim 1 , wherein the spacer particles comprise at least one of the group consisting of fully electrically conductive spacer particles, fully electrically insulating spacer particles, and spacer particles having an electrically insulating core and an electrically conductive coating at least partially covering the core.

6. The package according to claim 1 , wherein a minimum distance (d) between the carrier and the component maintained by the spacer particles is at least 20 μm.

7. The package according to claim 1 , wherein the component is a surface mounted device component.

8. The package according to claim 1 , wherein the carrier is a completely electrically conductive leadframe.

9. The package according to claim 1 , comprising an encapsulant encapsulating the component, the connection structure and part of the carrier.

10. The package according to claim 1 , comprising an electronic chip mounted on the carrier.

11. The package according to claim 1 , wherein a minimum distance (d) between the carrier and the component is defined by a diameter (D) of the spacer particles.

12. The package according to claim 1 , configured as a system in package.

13. A package, comprising:
a plate-type carrier which comprises a planar main surface that includes a first carrier section and a second carrier section that are separated by a recess;
a passive component having a planar main surface that includes a first surface portion and a second surface portion, wherein the first surface portion is electrically connected with the first carrier section by a first portion of a connection structure at least partially between a gap between the first surface portion and the first carrier section and the second surface portion is electrically connected with the second carrier section by a separate second portion of the connection structure at least partially between a gap between the second surface portion and the second carrier section such that the planar main surface of the carrier is opposing and at least substantially parallel with the planar main surface of the component;
the connection structure configured for spacing the carrier with regard to the component by maintaining a minimum distance (d) of at least 10 μm;

an encapsulant encapsulating at least part of the component;
wherein the connection structure comprises an at least partially electrically conductive glue in which the spacer particles are embedded; and
wherein a spacer material of the spacer particles is polymeric.

14. The package according to claim 13 , wherein the connection structure comprises spacer particles having a diameter (D) defining the minimum distance (d).

15. The package according to claim 13 , wherein the connection structure spaces the carrier with regard to the component by a minimum distance (d) of at least 20 μm.

Assignees

• Infineon Technologies Ag

Inventors

• Schindler Manfred
• Kalz Franz-Peter
• Strutz Volker

Classifications

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title