Method for Electrophoretically Depositing a Film on an Electronic Assembly

Patent metadata

Field	Value
Publication number	US-2016240449-A1
Application number	US-201615095784-A
Country	US
Kind code	A1
Filing date	Apr 11, 2016
Priority date	Sep 14, 2012
Publication date	Aug 18, 2016
Grant date	—

Abstract

A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.

First claim

What is claimed is:

1 . A system comprising:
a component carrier comprising a component carrier contact; a component disposed on the component carrier, the component comprising a component contact; a conductive connection element connecting the component carrier contact with the component contact; an insulating film disposed directly on at least one of the component, the conductive connection element, and the component carrier; and an encapsulant encapsulating the component carrier, the component and the conductive connection elements.

2 . The system according to claim 1 , wherein the insulating film comprises a thickness of ≦50 μm.

3 . The system according to claim 1 , wherein the conductive connection elements are wire bonds, wherein the component carrier is a leadframe, and wherein encapsulation material comprises a molding compound or a laminate material.

4 . The system according to claim 1 , wherein the insulating film is disposed directly on metallic surfaces of the component carrier, the component and the conductive connection element.

5 . The system according to claim 1 , wherein the insulating film is a polymer film.

6 . The system according to claim 5 , wherein the polymer film comprises a polyurethane resin.

7 . The system according to claim 5 , wherein the polymer film comprises a polar high performance thermoplastic.

8 . The system according to claim 5 , wherein the polymer film comprises an epoxy.

9 . The system according to claim 8 , wherein the polymer film comprises the epoxy with an anime type hardener.

10 . The system according to claim 1 , wherein the insulating film is based on a monomer and wherein the monomer comprises an acid-structure, a carbonyl-structure, a sulfonate-structure, an isocyanate-structure or a hydroxyl-structure.

11 . A method for manufacturing a system, the method comprising:
electrophoretic depositing an insulating film on a component carrier; attaching a component to the component carrier by placing an adhesive layer of the component to the insulating film of the component carrier; and encapsulating the component and the component carrier.

12 . The method according to claim 11 , wherein the component carrier is a leadframe.

13 . The method according to claim 12 , further comprising removing portions from the insulating film from leads, and wire bonding component contact pads to the component to the leads.

14 . The method according to claim 12 , further comprising removing portions from the insulating film from leads, and clip bonding component contact pads of the component to the leads.

15 . The method according to claim 11 , wherein attaching the component to the component carrier comprising forming an interleaved polymer to polymer interface.

16 . The method according to claim 11 , wherein the adhesive layer and the insulating film comprise complementary materials.

17 . A method for manufacturing a system, the method comprising:
placing a component on a component carrier; connecting a conductive connection element with a component contact of the component and a component carrier contact of the component carrier; and electrophoretic depositing an encapsulation material thereby encapsulating the conductive connection element, the component and the component carrier.

18 . The method according to claim 17 , wherein the component comprises a thickness of less than about 20 μm, and wherein a thickness of the encapsulation material comprises a thickness of less than about 50 μm.

19 . The method according to claim 17 , wherein the component comprises a thickness of about 20 μm to about 50 μm, and wherein a thickness of the encapsulation material comprises a thickness of about 20 μm to about 50 μm.

20 . The method according to claim 17 , wherein the encapsulation material comprises a polymer.

Assignees

• Infineon Technologies Ag

Inventors

• Mahler Joachim
• Mengel Manfred
• Hosseini Khalil
• Kalz Franz-Peter

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title