Deposition of protective material at wafer level in front end for early stage particle and moisture protection

Patent metadata

Field	Value
Publication number	US-10370244-B2
Application number	US-201715827057-A
Country	US
Kind code	B2
Filing date	Nov 30, 2017
Priority date	Nov 30, 2017
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

First claim

What is claimed is:

1. A method of protecting a microelectromechanical systems (MEMS) element, comprising:
providing at least one MEMS element, comprising a sensitive area, on a substrate;
depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, wherein the protective material permits a sensor functionality of the at least one MEMS element;
forming at least one stop frame on the substrate at a region that surrounds the at least one MEMS element, wherein the at least one stop frame is configured to confine the protective material inside the region
curing the protective material; and
removing the at least one stop frame subsequent to curing the protective material.

2. The method of claim 1 , further comprising:
separating a portion of the substrate that includes the at least one MEMS element to form a chip, wherein the chip includes at least one stress-decoupling trench laterally spaced from the at least one MEMS element and extending into the substrate, and the protective material is confined to an area within a region defined by the at least one stress-decoupling trench.

3. The method of claim 1 , wherein the at least one stop frame comprises imide, SU-8, or silicone, each having a higher degree of elastic modulus than the protective material.

4. The method of claim 1 , further comprising:
separating a portion of the substrate that includes the at least one MEMS element to form a chip, wherein the chip includes at least one stress-decoupling trench at an edge of the region such that the at least one stop frame is formed proximate to the at least one stress-decoupling trench and is configured to prevent the protective material from entering the at least one stress-decoupling trench.

5. The method of claim 1 , further comprising:
depositing a coating on the substrate at a region that surrounds the at least one MEMS element, wherein the coating is configured to confine the protective material inside the region.

6. The method of claim 1 , further comprising:
performing the package assembly process, including mounting a chip to a package, wherein the chip includes a portion of the substrate that includes the at least one MEMS element and that further includes the protective material disposed over the sensitive area of the at least one MEMS element.

7. The method of claim 1 , wherein depositing the protective material comprises:
depositing the protective material as a locally defined droplet confined to a local region of the substrate that surrounds the at least one MEMS element.

8. The method of claim 7 , wherein the protective material is deposited using inkjet printing or micro dispensing.

9. The method of claim 1 , wherein each of the at least one MEMS element is a pressure sensor.

10. The method of claim 1 , wherein the protective material is a temperature hardening gel or a ultraviolet (UV) hardening gel.

11. The method of claim 1 , wherein protective material permits full sensor functionality of the MEMS element, including mechanical functionality and electrical functionality, while sealing an entire surface of the at least one MEMS element.

12. The method of claim 1 , wherein the protective material is a permanent protective material deposited in between a front end process and a preassembly process or between the preassembly process and the package assembly process.

13. A semiconductor device comprising:
a semiconductor chip comprising:
a substrate;
at least one microelectromechanical systems (MEMS) element, comprising a sensitive area, disposed at a surface of the substrate; and
a protective material disposed over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, wherein the protective material is configured to permit a sensor functionality of the at least one MEMS element;
a package to which the semiconductor chip is mounted, wherein the package includes encapsulation material that is excluded from a first region, the first region extending over the sensitive area of the at least one MEMS element;
at least one stress-decoupling trench laterally spaced from the at least one MEMS element and extending into the substrate, and the protective material is confined to an area within a region defined by the at least one stress-decoupling trench,

wherein the at least one stress-decoupling trench defines an inside region of the surface of the substrate and a peripheral region of the surface of the substrate, and
the encapsulation material is attached to the surface of the substrate at the peripheral region, and the first region is defined at least by the inside region.

14. The semiconductor device of claim 13 , wherein the semiconductor chip further comprises:
at least one stop frame disposed on the surface of the substrate at a second region, the second region surrounding the at least one MEMS element, wherein the at least one stop frame is configured to confine the protective material inside the second region.

15. The semiconductor device of claim 14 , wherein the at least one stop frame comprises imide, SU-8, or silicone, each having a higher degree of elastic modulus than the protective material.

16. The semiconductor device of claim 14 , wherein
the at least one stress-decoupling trench is at an edge of the second region such that the at least one stop frame is formed proximate to the at least one stress-decoupling trench and is configured to prevent the protective material from entering the at least one stress-decoupling trench.

17. The semiconductor device of claim 13 , wherein:
each of the at least one MEMS element is a pressure sensor,
the protective material is a locally defined droplet confined to a local region of the substrate that surrounds the at least one MEMS element, and
the protective material permits full sensor functionality of the MEMS element, including mechanical functionality and electrical functionality, while sealing an entire surface of the at least one MEMS element.

18. A semiconductor device comprising:
a semiconductor chip comprising:
a substrate;
at least one microelectromechanical systems (MEMS) element, comprising a sensitive area, disposed at a surface of the substrate; and
a protective material disposed over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, wherein the protective material is configured to permit a sensor functionality of the at least one MEMS element;
a package to which the semiconductor chip is mounted, wherein the package includes encapsulation material that is excluded from a first region, the first region extending over the sensitive area of the at least one MEMS element;
at least one stop frame disposed on the surface of the substrate at a second region, the second region surrounding the at least one MEMS element, wherein the at least one stop frame is configured to confine the protective material inside the second region; and
a seal ring disposed on the surface of the substrate at a third region, the third region spaced apart from and surrounding the at least one stop frame, wherein the encapsulation material is attached to the surface of the substrate peripheral to the third region and is excluded from the surface of the substrate internal to the third region.

19. The semiconduct

Assignees

• Infineon Technologies Ag

Inventors

• Brandl Florian
• Fries Manfred
• Kalz Franz-Peter

Classifications

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/12

  characterised by their shape · CPC title

• B81C1/00325

  for reducing stress inside of the package structure · CPC title

• B81B2201/0264

  Pressure sensors · CPC title