Method for producing an aqueous foam
US-10759921-B2 · Sep 1, 2020 · US
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Imbert Bruno patents
Imbert Bruno is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Imbert Bruno |
| Total patents | 28 |
| First publication | Dec 17, 2015 |
| Latest publication | Sep 1, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for adhering a first structure and a second structure
US-10710192-B2 · Jul 14, 2020 · US
Method for assembling two substrates of different natures via a ductile intermediate layer
US-10679963-B2 · Jun 9, 2020 · US
Method for direct bonding of III-V semiconductor substrates with a radical oxide layer
US-10586783-B2 · Mar 10, 2020 · US
Metal-metal direct bonding method
US-10483111-B2 · Nov 19, 2019 · US
Direct bonding method
US-10403597-B2 · Sep 3, 2019 · US
Method for assembling substrates by bonding indium phosphate surfaces
US-10283364-B2 · May 7, 2019 · US
Direct bonding method
US-10236210-B2 · Mar 19, 2019 · US
Method for producing an aqueous foam, aqueous foam obtained by such a method and uses thereof
US-2018355139-A1 · Dec 13, 2018 · US
Method for assembling substrates by bonding indium phosphate surfaces
US-2018330950-A1 · Nov 15, 2018 · US
Recent patents
Latest publications not already listed above.
Method for direct adhesion via low-roughness metal layers
US-10115698-B2 · Oct 30, 2018 · US
Method for adhering a first structure and a second structure
US-2018297143-A1 · Oct 18, 2018 · US
Direct bonding method
US-2018218999-A1 · Aug 2, 2018 · US
Method for obtaining a bonding surface for direct bonding
US-10032742-B2 · Jul 24, 2018 · US
Method for implanting a piezoelectric material
US-9991439-B2 · Jun 5, 2018 · US
Direct bonding method
US-2018151436-A1 · May 31, 2018 · US
Process for producing a structure by assembling at least two elements by direct adhesive bonding
US-9922953-B2 · Mar 20, 2018 · US
Metal-metal direct bonding method
US-2018019124-A1 · Jan 18, 2018 · US
Method for direct adhesion via low-roughness metal layers
US-2017236800-A1 · Aug 17, 2017 · US
Process for manufacturing a semiconductor structure with temporary bonding via metal layers
US-9735038-B2 · Aug 15, 2017 · US
Tungsten layer passivation process and direct bonding process
US-2017213807-A1 · Jul 27, 2017 · US
Method for manufacturing substrates
US-2017133347-A1 · May 11, 2017 · US
Process for producing a structure by assembling at least two elements by direct adhesive bonding
US-2017025377-A1 · Jan 26, 2017 · US
Method for carrying out a conductive direct metal bonding
US-9472530-B2 · Oct 18, 2016 · US
Process for manufacturing a semiconductor structure with temporary bonding via metal layers
US-2016189995-A1 · Jun 30, 2016 · US
Method for assembling two substrates of different natures via a ductile intermediate layer
US-2016126215-A1 · May 5, 2016 · US
Method for carrying out a conductive direct metal bonding
US-2015380383-A1 · Dec 31, 2015 · US
Method for obtaining a bonding surface for direct bonding
US-2015364442-A1 · Dec 17, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P10/128 | 17 |
| H01L24/83 | 17 |
| H10W72/07331 | 12 |
| H01L21/187 | 10 |
| H10W72/952 | 7 |