Method for carrying out a conductive direct metal bonding

Patent metadata

Field	Value
Publication number	US-9472530-B2
Application number	US-201414768886-A
Country	US
Kind code	B2
Filing date	Mar 5, 2014
Priority date	Mar 5, 2013
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A method includes a) Providing a first substrate covered by a metal layer and a second substrate covered by a metal layer, b) Bringing into direct contact the metal layers so as to form a bonding interface having metal material bridges separated by cavities which are fluidly connected to each other, d) Immersing the bonding interface in an oxidizing fluid so as to form a metal oxide which fills at least in part the cavities and metal/metal oxide/metal contact areas. A structure is also provided having a first substrate, a first metal layer, a second metal layer forming a bonding layer with the first metal layer, and a second substrate, the bonding interface having: metal material bridges separated by cavities, a metal oxide partially filling the cavities, and metal/metal oxide/metal contact areas.

First claim

The invention claimed is:

1. A method for carrying out a conductive direct metal bonding between two substrates of semi-conductive materials, comprising the steps of:
a) Providing a first substrate a surface of which is covered by a first metal layer, and a second substrate a surface of which is covered by a second metal layer,
b) Bringing into direct contact the first metal layer and the second metal layer so as to form a bonding interface comprising metal material bridges between the first metal layer and the second metal layer, the metal material bridges being separated by cavities which are fluidly connected to each other,
d) Immersing the bonding interface in an oxidizing fluid so as to oxidize, at least in part, portions of the first metal layer and portions of the second metal layer which delimit the cavities, this oxidation generating a metal oxide which fills, at least in part, the cavities, the metal oxide forming contact areas between the portions of the first metal layer and the second metal layer which delimit the cavities.

2. The method according to claim 1 , wherein prior to step a) of providing a first substrate and a second substrate, the method comprises a step of depositing, by CVD (Chemical Vapor Deposition), the first metal layer and the second metal layer respectively on said surface of the first substrate and on said surface of the second substrate.

3. The method according to claim 1 , wherein the immersion step d) is carried out over a time period comprised between about 30 minutes and several hours so as to enable the penetration of the oxidizing fluid and the growth of the metal oxide in the cavities.

4. The method according to claim 1 , wherein between the steps b) and d), the method comprises a step c) of applying a thermal budget of bonding annealing.

5. The method according to claim 4 , wherein the application of the thermal budget, according to step c), further comprises a step c 1 ) of applying a pressure on either side of the bonding interface.

6. The method according to claim 1 , wherein prior to the contacting step b), the method comprises a step consisting in smoothing the surfaces of the first metal layer and the second metal layer.

7. The method according to claim 1 , wherein, the immersion step d) comprises heating the oxidizing fluid.

8. The method according to claim 1 , wherein, subsequently to step d), the method comprises a step e) of applying a heat treatment for strengthening the bonding.

9. The method according to claim 1 , wherein the oxidizing fluid comprises an oxidizing gas or an oxidizing liquid.

10. The method according to claim 1 , wherein the metal of the first metal layer and the metal of the second metal layer are chosen among copper, molybdenum, tungsten and their alloys.

11. The method according to claim 1 , wherein the metal of the first metal layer is identical to the metal of the second metal layer.

12. The method according to claim 4 , wherein the application of the thermal budget according to step c) is carried out at a temperature comprised between 30° C. and 400° C., over a time period comprised between a few tens of minutes and several hours.

13. The method according to claim 1 , wherein the first metal layer completely covers said surface of the first substrate and in that the second metal layer completely covers said surface of the second substrate.

14. The method according to claim 1 , wherein the first metal layer and the second metal layer respectively comprise a plurality of first metal pads between which a first insulating material extends and a plurality of second metal pads between which a second insulating material extends, the height of the first metal pads and the height of the second metal pads being smaller than or equal to respectively a thickness of the first insulating material and a thickness of the second insulating material.

15. A structure presenting a vertical electrical conductivity and comprising a stack including successively:
a first substrate of a semi-conductive material,
a first metal layer,
a second metal layer directly bonded to the first metal layer by direct bonding so as to form an electrically conductive bonding interface, and
a second substrate of a semi-conductive material,
the bonding interface comprising:

metal material bridges between the first metal layer and the second metal layer, the metal material bridges being separated by cavities,
a metal oxide, generated by immersion in an oxidizing fluid and the oxidation of the portions of the first metal layer and the second metal layer which delimit the cavities, filling at least in part the cavities, the metal oxide forming contact areas between the portions of the first metal layer and the second metal layer which delimit the cavities.

16. The structure according to claim 15 , wherein at least 50% of the cavities, partially filled with the metal oxide, present a dimension smaller than or equal to 50 nanometers.

17. The structure according to claim 15 , wherein the first metal layer completely covers a surface of the first substrate and in that the second metal layer completely covers a surface of the second substrate.

18. The structure according to claim 15 , wherein the structure comprises a first insulating material and a second insulating material and in that the first metal layer and the second metal layer respectively comprise a plurality of first metal pads between which the first insulating material extends and a plurality of second metal pads between which the second insulating material extends, the height of the first metal pads and the height of the second metal pads being smaller than or equal to respectively a thickness of the first insulating material and a thickness of the second insulating material.

Assignees

• Commissariat Energie Atomique

Inventors

• Gondcharton Paul
• Benaissa Lamine
• Imbert Bruno

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W80/312

  characterised by the direct bonding of electrically conductive pads · CPC title

• H10W80/334

  Thermocompression bonding · CPC title

• H10W90/792

  between multiple chips · CPC title