Method for adhering a first structure and a second structure

Patent metadata

Field	Value
Publication number	US-10710192-B2
Application number	US-201615574085-A
Country	US
Kind code	B2
Filing date	May 13, 2016
Priority date	May 13, 2015
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

A method includes steps a) providing the first structure successively including a first substrate, a first layer made from a metal base and a first metal-based metal oxide, b) providing the second structure successively including a second substrate, a second layer made from a second material and a second metal-based metal oxide, the first and second metal oxides presenting a standard free enthalpy of formation ΔG°, the second material being chosen so that it has an oxide presenting a standard free enthalpy of formation strictly less than ΔG°, c) bonding the first structure and second structure by direct adhesion, d) activating diffusion of the oxygen atoms of the first and second metal oxides to the second layer so as to form the oxide of the second material.

First claim

The invention claimed is:

1. A method of bonding a first structure with a second structure, the method comprising:
a) providing the first structure successively comprising:
a first substrate,
a first layer made from a first material based on tungsten, and
a first oxide based on tungsten with 1-4 oxygen atoms,

b) providing the second structure successively comprising:
a second substrate,
a second layer made from a second material based on silicon, and
a second oxide based on tungsten with 1-4 oxygen atoms, the second oxide being in direct contact with the second layer,

wherein step b) comprises directly depositing the second oxide on the second layer,
c) bonding the first structure with the second structure by direct adhesion between the first oxide and the second oxide, and
d) activating diffusion of the oxygen atoms of the first and second oxides to the second layer so as to form the oxide of the second material in all or part of the thickness of the second layer.

2. The method according to claim 1 , wherein step b) comprises a step b1) consisting of forming metallic bumps in the whole thickness of the second layer.

3. The method according to claim 1 , wherein the first structure and the second structure bonded in step c) form an assembly, and wherein step d) is executed by applying a thermal anneal to the assembly.

4. The method according to claim 1 , wherein step d) is executed by applying a potential difference between the first and second substrates.

5. The method according to claim 1 , wherein step a) comprises directly depositing the first oxide on the first layer.

6. The method according to claim 1 , wherein the second oxide is directly deposited on the second layer by a technique selected from the group consisting of physical vapor deposition, chemical vapor deposition, and thermal oxidation.

7. The method according to claim 3 ,
wherein the thermal anneal presents:
an annealing temperature comprised between 100° C. and 600° C.,
an annealing time of more than 30 min.

8. The method according to claim 1 , wherein the second material is amorphous silicon-based.

9. The method according to claim 7 , wherein the annealing temperature is between 350° C. and 550° C.

10. The method according to claim 7 , wherein the annealing time is more than 1 hour.

11. The method according to claim 5 , wherein the first oxide is directly deposited on the first layer by a technique selected from the group consisting of physical vapor deposition, chemical vapor deposition, and thermal oxidation.

Assignees

• Commissariat Energie Atomique

Inventors

• Imbert Bruno
• Benaissa Lamine
• Gondcharton Paul

Classifications

• H10P10/128 Primary

  by direct semiconductor to semiconductor bonding · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/01365

  Thermally treating (reflowing H10W72/01357) · CPC title

• C22F1/18

  High-melting or refractory metals or alloys based thereon · CPC title

• B23K20/02 Primary

  by means of a press {; Diffusion bonding} · CPC title