Flip-chip mounting structure and flip-chip mounting method
US-2024387444-A1 · Nov 21, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/83 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 7,140 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 528 |
| 2016 | 638 |
| 2017 | 690 |
| 2018 | 686 |
| 2019 | 721 |
| 2020 | 780 |
| 2021 | 652 |
| 2022 | 583 |
| 2023 | 569 |
| 2024 | 626 |
| 2025 | 558 |
| 2026 | 109 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Biometric sensor module for a smart card and method for manufacturing such a module
US-12131987-B2 · Oct 29, 2024 · US
Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Integrated fan-out package and manufacturing method thereof
US-2024178120-A1 · May 30, 2024 · US
Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in solar cells and other energy conversion devices
US-2024115878-A1 · Apr 11, 2024 · US
Stacked semiconductor method and apparatus
US-2024096745-A1 · Mar 21, 2024 · US
Power semiconductor component and method for producing a power semiconductor component
US-2024096738-A1 · Mar 21, 2024 · US
Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package
US-2024063048-A1 · Feb 22, 2024 · US
Method for manufacturing semiconductor device
US-2015380274-A1 · Dec 31, 2015 · US
Method of fabricating an integrated circuit device, and an integrated circuit device therefrom
US-2015380353-A1 · Dec 31, 2015 · US
Method of manufacturing a semiconductor device
US-2015364458-A1 · Dec 17, 2015 · US
Non-leaded type semiconductor package and method of assembling same
US-9214447-B2 · Dec 15, 2015 · US
Electronic device packages having bumps and methods of manufacturing the same
US-9209146-B2 · Dec 8, 2015 · US
Optoelectronic package and method for making same
US-2015348953-A1 · Dec 3, 2015 · US
Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
US-9196562-B2 · Nov 24, 2015 · US
Integrated bondline spacers for wafer level packaged circuit devices
US-9187312-B2 · Nov 17, 2015 · US
Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant
US-9184104-B1 · Nov 10, 2015 · US
Semiconductor device and method of manufacturing the same
US-9177833-B2 · Nov 3, 2015 · US
Integrated bondline spacers for wafer level packaged circuit devices
US-9174836-B2 · Nov 3, 2015 · US
Stacked semiconductor die assemblies with support members and associated systems and methods
US-2015311185-A1 · Oct 29, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/83?
- CPC H01L24/83 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/83 (Electricity)?
- Our database includes 7,140 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/83 growing?
- Publication counts under this code: 626 in 2024 vs 558 in 2025 (latest complete years).