Process for producing a structure by assembling at least two elements by direct adhesive bonding

Patent metadata

Field	Value
Publication number	US-9922953-B2
Application number	US-201515121855-A
Country	US
Kind code	B2
Filing date	Feb 26, 2015
Priority date	Feb 27, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A method for producing a structure by direct bonding of two elements, the method including: production of the elements to be assembled and assembly of the elements. The production of the elements to be assembled includes: deposition on a substrate of a TiN layer by physical vapor deposition, and deposition of a copper layer on the TiN layer. The assembly of the elements includes: polishing the surfaces of the copper layers intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, bringing the surfaces into contact, and storing the structure at atmospheric pressure and at ambient temperature.

First claim

The invention claimed is:

1. A production method for producing a structure by direct bonding of two elements, the method comprising producing elements to be assembled and assembling the elements, wherein:
the producing of the elements comprises:
depositing at least one growth portion made from at least one material selected from the group consisting of TiN x and TaN x on a substrate, the growth portion being deposited by physical vapor deposition, and
depositing at least one first portion of copper on all or part of the growth portion, conditions for depositing the growth portion by physical vapor deposition being such that a ratio between an intensity of the peak representing the orientation (220) and an intensity of the peak representing the orientation (111) in the first portion of copper is greater than or equal to 0.5, whereby the peaks are measured by X-Ray diffraction; and

the assembling of the elements comprises:
polishing surfaces of the first portion of copper intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, to obtain polished surfaces,
bringing the polished surfaces into contact, to obtain a structure, and
storing the structure at a low temperature.

2. The production method according to claim 1 , wherein the depositing of the growth portion by physical vapor deposition occurs at a temperature between −196° C. and 250° C.

3. The production method according to claim 1 , wherein the depositing of the growth portion by physical vapor deposition occurs at a temperature between 20° C. and 100° C.

4. The production method according to claim 1 , wherein conditions for the depositing of the growth portion by physical vapor deposition are such that the first portion of copper has a growth favoring less dense planes of families (110) and (100).

5. The production method according to claim 1 , wherein the material of the growth portion is TiN.

6. The production method according to claim 1 , wherein the first portion of copper is formed by physical vapor deposition.

7. The production method according to claim 1 , wherein, on least one of the elements, at least one second portion of copper is formed on the first portion of copper.

8. The production method according to claim 7 , wherein the second portion of copper is formed by electrochemical deposition, atomic deposition, physical vapor deposition, or chemical vapor deposition.

9. The production method according to claim 7 , further comprising incorporating at least one chemical species in or on the first or second portion of copper.

10. The production method according to claim 9 , wherein the at least one chemical species is at least one selected from the group consisting of boron, carbon, phosphorus, sulfur, chlorine and oxygen.

11. The production method according to claim 9 , wherein the incorporating of the at least one chemical species occurs by ion implantation and deposition or by heat-assisted or non-heat-assisted diffusion.

12. The production method according to claim 9 , wherein the incorporating of the at least one chemical species occurs during the polishing.

13. The production method according to claim 9 , wherein the second portion of copper is formed by electrochemical deposition and the chemical species is incorporated during the electrochemical deposition.

14. The production method according to claim 1 , wherein the storing occurs at a temperature of between 75° C. and 100° C.

15. The production method according to claim 1 , wherein the bringing the polished surfaces into contact occurs at a humidity level at least equal to 20%.

16. The production method according to claim 1 , wherein the structure is a microelectronic structure, a nanoelectronic structure, or both.

17. The production method according to claim 16 , wherein the portions of copper form interconnection vias.

Assignees

• Commissariat Energie Atomique

Inventors

• Gondcharton Paul
• Benaissa Lamine
• Imbert Bruno
• Moriceau Hubert

Classifications

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/01951

  Changing the shapes of bond pads · CPC title

• H10W72/01971

  Cleaning, e.g. oxide removal · CPC title