Highly regular logic design for efficient 3D integration
US-12557392-B2 · Feb 17, 2026 · US
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Devilliers Anton patents
Devilliers Anton is listed as an inventor on 109 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Devilliers Anton |
| Total patents | 109 |
| First publication | Feb 12, 2015 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus and method for wafer alignment
US-12512356-B2 · Dec 30, 2025 · US
Wafer overlay registration in hybrid bonding
US-2025391808-A1 · Dec 25, 2025 · US
Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer
US-12506019-B2 · Dec 23, 2025 · US
Die to wafer bonding method and apparatus with thermal contact die shape control
US-2025308949-A1 · Oct 2, 2025 · US
Die to wafer bonding method and apparatus with thermal contactless die shape control
US-2025308951-A1 · Oct 2, 2025 · US
Patterning a substrate using a multi-patterning technique
US-2025306463-A1 · Oct 2, 2025 · US
Using laser based system for mean of shaping of unsingulated & singulated dies by substrate lattice manipulation
US-2025308902-A1 · Oct 2, 2025 · US
Novel Wafer Chuck Designs And Methods For Retaining A Processing Liquid On A Surface Of A Semiconductor Wafer
US-2025285883-A1 · Sep 11, 2025 · US
Wet Processing Systems Having Novel Wafer Chuck Designs For Retaining A Processing Liquid On A Surface Of A Semiconductor Substrate
US-2025285884-A1 · Sep 11, 2025 · US
Recent patents
Latest publications not already listed above.
3D multiple location compressing bonded arm for advanced integration
US-12381118-B2 · Aug 5, 2025 · US
Replacement buried power rail in backside power delivery
US-12354991-B2 · Jul 8, 2025 · US
Self-aligned method for vertical recess for 3D device integration
US-12336274-B2 · Jun 17, 2025 · US
Device and method for determining wafer bow
US-2025123090-A1 · Apr 17, 2025 · US
Circuit design modeling for bonding integrated circuits
US-2025068823-A1 · Feb 27, 2025 · US
Method of patterning a substrate using a sidewall spacer etch mask
US-12099299-B2 · Sep 24, 2024 · US
Method for cell layout
US-2024289529-A1 · Aug 29, 2024 · US
Apparatus and method for wafer alignment
US-2024203778-A1 · Jun 20, 2024 · US
Three-dimensional multiple location compressing bonded arm-poisedon 4 and poisedon 5 advanced integration
US-2024203797-A1 · Jun 20, 2024 · US
Method of manufacturing a semiconductor apparatus having stacked devices
US-12014984-B2 · Jun 18, 2024 · US
Method for recessing a fill material within openings formed on a patterned substrate
US-11848236-B2 · Dec 19, 2023 · US
Method of patterning a substrate using a sidewall spacer etch mask
US-2023367217-A1 · Nov 16, 2023 · US
Method of patterning a substrate using a sidewall spacer etch mask
US-11782346-B2 · Oct 10, 2023 · US
Planarization of spin-on films
US-11776808-B2 · Oct 3, 2023 · US
Method of 3D logic fabrication to sequentially decrease processing temperature and maintain material thermal thresholds
US-11764113-B2 · Sep 19, 2023 · US
Power delivery network for CFET with buried power rails
US-11735525-B2 · Aug 22, 2023 · US
Method of making 3D circuits with integrated stacked 3D metal lines for high density circuits
US-11721582-B2 · Aug 8, 2023 · US
Methods of Forming Patterns
US-2023052800-A1 · Feb 16, 2023 · US
Apparatus and method for simultaneous formation of diffusion break, gate cut, and independent N and P gates for 3D transistor devices
US-11574845-B2 · Feb 7, 2023 · US
Self-aligned method for vertical recess for 3d device integration
US-2023036597-A1 · Feb 2, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 98 |
| Micron Technology Inc | 10 |
| Devilliers Anton | 2 |
| He Yuan | 1 |
| Jain Kaveri | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 51 |
| H10D88/01 | 35 |
| H10D84/85 | 32 |
| H10D88/00 | 32 |
| H10D84/0186 | 32 |