Circuit design modeling for bonding integrated circuits

Patent metadata

Field	Value
Publication number	US-2025068823-A1
Application number	US-202418615365-A
Country	US
Kind code	A1
Filing date	Mar 25, 2024
Priority date	Aug 25, 2023
Publication date	Feb 27, 2025
Grant date	—

Abstract

A method includes receiving a first layout file for a first workpiece and a second layout file for a second workpiece. First layout file and second layout file are analyzed to identify contact points, which are grouped into bins. A contact point of a first bin is simulated using a simulation model. Contact point includes a first feature of the first workpiece and a second feature of the second workpiece. In response to determining that the contact point does not have desired properties, a first layout of the first feature and a second layout of the second feature are updated to determine an updated contact point. Updated contact point is simulated using the simulation model. In response to determining that the updated contact point has the desired properties, first layout file is updated to include updated first layout, and second layout file is updated to include updated second layout.

First claim

What is claimed is:

1 . A system comprising:
a memory configured to store:
a simulation model; and
process parameters of a bonding process; and
a processor communicatively coupled to the memory, wherein the processor is configured to:
receive a first layout file, first design rules, first parameter variations, and first material parameters for a first workpiece;
receive a second layout file, second design rules, second parameter variations, and second material parameters for a second workpiece;
analyze the first layout file and the second layout file to identify a plurality of contact points, wherein each contact point comprises a feature of the first workpiece and a feature of the second workpiece;
determine types of the plurality of contact points based on the first layout file and the second layout file;
group the plurality of contact points into a plurality of bins, wherein each bin includes a subset of the plurality of contact points having a same type;
simulate a first contact point of a first bin of the plurality of bins using the simulation model, wherein the first contact point comprises a first feature of the first workpiece and a second feature of the second workpiece;
determine whether the first contact point has desired properties; and
in response to determining that the first contact point does not have the desired properties:
update a first layout of the first feature and a second layout of the second feature to determine an updated first contact point;
simulate the updated first contact point using the simulation model;
determine whether the updated first contact point has the desired properties; and
in response to determining that the updated first contact point has the desired properties:
update the first layout file to include the updated first layout of the first feature; and
update the second layout file to include the updated second layout of the second feature.

2 . The system of claim 1 , wherein the processor is further configured to, in response to determining that the updated first contact point does not have the desired properties, update the process parameters of the bonding process.

3 . The system of claim 2 , wherein the processor is further configured to send the updated process parameters of the bonding process to a bonding apparatus.

4 . The system of claim 1 , wherein the processor is further configured to:
receive test results, the test results being obtained from testing a test chip comprising the updated first contact point; and update the simulation model based on the test results.

5 . The system of claim 1 , wherein the processor is further configured to, in response to determining that the updated first contact point has the desired properties:
simulate a second contact point of a second bin of the plurality of bins using the simulation model, wherein the second contact point comprises a third feature of the first workpiece and a fourth feature of the second workpiece;
determine whether the second contact point has desired properties; and
in response to determining that the second contact point does not have the desired properties:
update a third layout of the third feature and a fourth layout of the fourth feature to determine an updated second contact point;
simulate the updated second contact point using the simulation model;
determine whether the updated second contact point has the desired properties; and
in response to determining that the updated second contact point has the desired properties:
update the first layout file to include the updated third layout of the third feature; and
update the second layout file to include the updated fourth layout of the fourth feature.

6 . The system of claim 5 , wherein the first contact point and the second contact point are simulated in parallel.

7 . The system of claim 1 , wherein the simulation model simulates the bonding process between the first workpiece and the second workpiece.

8 . A method comprising:
receiving a first layout file, first design rules, first parameter variations, and first material parameters for a first workpiece; receiving a second layout file, second design rules, second parameter variations, and second material parameters for a second workpiece; analyzing the first layout file and the second layout file to identify a plurality of contact points, wherein each contact point comprises a feature of the first workpiece and a feature of the second workpiece; determining types of the plurality of contact points based on the first layout file and the second layout file; grouping the plurality of contact points into a plurality of bins, wherein each bin includes a subset of the plurality of contact points having a same type; simulating a first contact point of a first bin of the plurality of bins using a simulation model, wherein the first contact point comprises a first feature of the first workpiece and a second feature of the second workpiece; determining whether the first contact point has desired properties; and in response to determining that the first contact point does not have the desired properties:
updating a first layout of the first feature and a second layout of the second feature to determine an updated first contact point;
simulating the updated first contact point using the simulation model;
determining whether the updated first contact point has the desired properties; and
in response to determining that the updated first contact point has the desired properties:
updating the first layout file to include the updated first layout of the first feature; and
updating the second layout file to include the updated second layout of the second feature.

9 . The method of claim 8 , further comprising, in response to determining that the updated first contact point does not have the desired properties, updating process parameters of a bonding process.

10 . The method of claim 9 , further comprising sending the updated process parameters of the bonding process to a bonding apparatus.

11 . The method of claim 8 , further comprising:
receiving test results, the test results being obtained from testing a test chip comprising the updated first contact point; and updating the simulation model based on the test results.

12 . The method of claim 8 , further comprising, in response to determining that the updated first contact point has the desired properties:
simulating a second contact point of a second bin of the plurality of bins using the simulation model, wherein the second contact point comprises a third feature of the first workpiece and a fourth feature of the second workpiece; determining whether the second contact point has desired properties; and in response to determining that the second contact point does not have the desired properties:
updating a third layout of the third feature and a fourth layout of the fourth feature to determine an updated second contact point;
simulating the updated second contact point using the simulation model;
determining whether the updated second contact point has the desired properties; and
in response to determining that the updated second contact point has the desired properties:
updating the first layout file to include the updated third layout of the third feature; and
updating the second layout file to include the updated fourth layout of the fourth feature.

13 . The method of claim 12 , wherein the first contact point and the second contact point are simulated in parallel.

14 . The method of claim 8 , wherein the simulation model simulates a bonding process between

Assignees

• Tokyo Electron Ltd

Inventors

• Fulford Henry Jim
• Mukhopadhyay Partha
• Caribe Zuriel
• Devilliers Anton

Classifications

• H10W80/312

  characterised by the direct bonding of electrically conductive pads · CPC title

• H10W80/327

  characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers · CPC title

• H10W80/301

  Bonding techniques, e.g. hybrid bonding · CPC title

• H10W80/102

  Controlling the environment during the bonding, e.g. the temperature or pressure · CPC title

• H10W90/792

  between multiple chips · CPC title