Component-embedded substrate
US-9854681-B2 · Dec 26, 2017 · US
characterized by laminating only or mainly similar single-sided circuit boards
characterized by laminating only or mainly similar single-sided circuit boards · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/4617 |
| Official title | {characterized by laminating only or mainly similar single-sided circuit boards} |
| Display label | characterized by laminating only or mainly similar single-sided circuit boards |
| Total patents | 237 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 25 |
| 2017 | 29 |
| 2018 | 28 |
| 2019 | 29 |
| 2020 | 28 |
| 2021 | 22 |
| 2022 | 18 |
| 2023 | 12 |
| 2024 | 12 |
| 2025 | 9 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic component, method for manufacturing the electronic component, and circuit board
US-9854685-B2 · Dec 26, 2017 · US
Circuit board and method for producing same
US-9832889-B2 · Nov 28, 2017 · US
Multilayered substrate and method of manufacturing the same
US-9832866-B2 · Nov 28, 2017 · US
Manufacturing method of multilayer printed wiring board
US-9788439-B2 · Oct 10, 2017 · US
Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet
US-2017290165-A1 · Oct 5, 2017 · US
Buildup board structure
US-2017287617-A1 · Oct 5, 2017 · US
Angled circuit board connector
US-9780465-B1 · Oct 3, 2017 · US
Stretchable circuit board and method for manufacturing the same
US-2017245362-A1 · Aug 24, 2017 · US
Antenna device and wireless communication apparatus
US-9705193-B2 · Jul 11, 2017 · US
Component-embedded board and communication terminal device
US-9699908-B2 · Jul 4, 2017 · US
Method for manufacturing multilayer circuit board, and multilayer circuit board
US-2017188459-A1 · Jun 29, 2017 · US
Component-embedded substrate
US-2017156214-A1 · Jun 1, 2017 · US
Multilayer printed circuit board and method of manufacturing the same
US-9668362-B2 · May 30, 2017 · US
Component built-in board mounting body and method of manufacturing the same, and component built-in board
US-9635763-B2 · Apr 25, 2017 · US
Printed circuit board and electronic apparatus
US-2017094787-A1 · Mar 30, 2017 · US
Multi-layered printed circuit board having inner-layer portion and outer-layer portions and manufacturing method thereof
US-9603265-B2 · Mar 21, 2017 · US
Antenna device and wireless communication apparatus
US-2017040697-A1 · Feb 9, 2017 · US
Flexible printed circuit
US-9560748-B2 · Jan 31, 2017 · US
Multilayered substrate and method of manufacturing the same
US-2016381794-A1 · Dec 29, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/4617?
- CPC H05K3/4617 is the Cooperative Patent Classification code for “characterized by laminating only or mainly similar single-sided circuit boards.”
- How many patents are filed under CPC H05K3/4617 (characterized by laminating only or mainly similar single-sided circuit boards)?
- Our database includes 237 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/4617 growing?
- Publication counts under this code: 12 in 2024 vs 9 in 2025 (latest complete years).