Component built-in board mounting body and method of manufacturing the same, and component built-in board

Patent metadata

Field	Value
Publication number	US-9635763-B2
Application number	US-201414229425-A
Country	US
Kind code	B2
Filing date	Mar 28, 2014
Priority date	Sep 30, 2011
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A component built-in board mounting body has a component built-in board mounted on a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and having an electronic component built in thereto, wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, and is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and a surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via and the thermal wiring, and is thermally connected to the mounting board via the bump.

First claim

What is claimed is:

1. A component built-in board mounting body that has a component built-in board mounted on a mounting surface of a mounting board, the component built-in board being configured having stacked therein, in a stacking direction, a plurality of printed wiring bases that each have a wiring pattern and a via, the wiring pattern being formed on a resin base thereof and the via being formed in the resin base thereof, and the component built-in board being configured having an electronic component built in thereto,
wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via,
wherein the thermal wiring and the thermal via are partially disposed at a position outside an outer periphery of the electronic component in a direction orthogonal to the stacking direction, and
wherein the component built-in board is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and an opposite surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via, the thermal wiring, and the thermal wiring and the thermal via disposed at the position outside the outer periphery of the electronic component, and is thermally connected to the mounting board via the bump,
wherein one printed wiring base of the plurality of printed wiring bases includes an opening receiving the electronic component,
the thermal via disposed at the position outside the outer periphery of the electronic component penetrates the one printed wiring base in the stacking direction.

2. The component built-in board mounting body according to claim 1 , wherein
the electronic component is disposed between the thermal wiring and the mounting board in the stacking direction of the printed wiring bases.

3. The component built-in board mounting body according to claim 1 , wherein the opposite surface directly contacts the thermal via.

4. A method of manufacturing a component built-in board mounting body, the component built-in board mounting body having a component built-in board mounted on a mounting surface of a mounting board, the component built-in board being configured having stacked therein, in a stacking direction, a plurality of printed wiring bases that each have a wiring pattern and a via, the wiring pattern being formed on a resin base thereof and the via being formed in the resin base thereof, and the component built-in board being configured having an electronic component built in thereto, the method comprising the steps of:
forming the wiring pattern including thermal wiring and the via including a thermal via in a plurality of the resin bases such that the thermal wiring and the thermal via are partially disposed at a position outside an outer periphery of the electronic component in a direction orthogonal to the stacking direction, and forming in at least one of the plurality of resin bases an opening where the electronic component is built in, thereby forming the plurality of printed wiring bases;
collectively stacking the plurality of printed wiring bases by thermal compression bonding such that an opposite surface on an opposite side to an electrode formation surface of the electronic component is connected to the thermal wiring via the thermal via, and is connected to a surface layer of the component built-in board via the thermal wiring and the thermal via disposed at the position outside the outer periphery of the electronic component, thereby forming the component built-in board;
forming on the surface layer of the component built-in board a bump connected to the thermal wiring; and
mounting the component built-in board on the mounting surface of the mounting board via the bump,
wherein the thermal via disposed at the position outside the outer periphery of the electronic component penetrates the one of the plurality of resin bases in the stacking direction.

5. The method of manufacturing a component built-in board mounting body according to claim 4 , wherein the opposite surface directly contacts the thermal via.

6. A component built-in board that is configured having stacked therein, in a stacking direction, a plurality of printed wiring bases each having a wiring pattern and a via, the wiring pattern being formed on a resin base thereof and the via being formed in the resin base thereof, and that is configured having an electronic component built in thereto,
wherein at least a portion of the plurality of printed wiring bases include thermal wiring in the wiring pattern and include a thermal via in the via,
wherein the thermal wiring and the thermal via are partially disposed at a position outside an outer periphery of the electronic component in a direction orthogonal to the stacking direction, and
wherein the component built-in board is mounted on a mounting board via a bump formed on a surface layer of the component built-in board, and an opposite surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via, the thermal wiring, and the thermal wiring and the thermal via disposed at the position outside the outer periphery of the electronic component,
wherein one printed wiring base of the plurality of printed wiring bases includes an opening receiving the electronic component, and
the thermal via disposed at the position outside the outer periphery of the electronic component penetrates the one printed wiring base in the stacking direction.

7. The component built-in board according to claim 6 , wherein the opposite surface directly contacts the thermal via.

Assignees

• Fujikura Ltd

Inventors

• Ueta Nobuki

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title