Component-embedded substrate

Patent metadata

Field	Value
Publication number	US-9854681-B2
Application number	US-201414327806-A
Country	US
Kind code	B2
Filing date	Jul 10, 2014
Priority date	Feb 17, 2012
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; and a first embedded chip-type electronic component disposed in the resin substrate. The first embedded chip-type electronic component is located close to the peripheral surface of the resin substrate. The mount surface includes: a first region located between the first and second mounted components and extending along a cross direction crossing an arrangement direction along which the first and second mounted components are arranged with respect to each other; and a second region located outside the first region. The first embedded chip-type electronic component is arranged to extend in the first and second regions as seen from above the mount surface.

First claim

The invention claimed is:

1. A component-embedded substrate comprising:
a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of said mount surface;
a first mounted component mounted on said mount surface;
a second mounted component mounted on said mount surface and spaced from said first mounted component;
at least one first embedded electronic component chip disposed in said resin substrate; and
at least one second embedded electronic component chip disposed in said resin substrate and arranged to extend in a first region of the mount surface and a second region of the mount surface as viewed in a direction perpendicular to said mount surface,
said first embedded electronic component chip being located close to the peripheral surface of said resin substrate,
said mount surface including:
said first region located between said first mounted component and said second mounted component and extending in a cross direction crossing an arrangement direction in which said first mounted component and said second mounted component are arranged with respect to each other; and
said second region located outside said first region,

said first embedded electronic component chip being arranged to extend in said first region and said second region as viewed in a direction perpendicular to said mount surface,
wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component,
wherein at least one of the first mounted component and the second mounted component comprises a chip component, and
wherein said second embedded electronic component chip overlaps a part of said first mounted component and a part of said second mounted component when viewed in the direction perpendicular to said mount surface, said second embedded electronic component chip extending below said first mounted component and said second mounted component.

2. The component-embedded substrate according to claim 1 , wherein said first embedded electronic component chip is larger in size than said second embedded electronic component chip.

3. A component-embedded substrate comprising:
a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of said mount surface;
a first mounted component mounted on said mount surface;
a second mounted component mounted on said mount surface and spaced from said first mounted component; and
at least one first embedded electronic component chip disposed in said resin substrate,
said first embedded electronic component chip being located close to the peripheral surface of said resin substrate,
said mount surface including:
a first region located between said first mounted component and said second mounted component and extending in a cross direction crossing an arrangement direction in which said first mounted component and said second mounted component are arranged with respect to each other; and
a second region located outside said first region,

said first embedded electronic component chip being arranged to extend in said first region and said second region as viewed in a direction perpendicular to said mount surface,
wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component,
wherein at least one of the first mounted component and the second mounted component comprises a chip component,
wherein said peripheral surface includes a first side surface and a second side surface opposite to said first side surface, said first and second side surfaces being located with respect to each other along said cross direction, and
wherein said first embedded electronic component chip includes a first electronic component located relatively closer to said first side surface as compared with said second mounted component, and a second electronic component chip located relatively closer to said second side surface as compared with said first mounted component.

4. A component-embedded substrate comprising:
a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of said mount surface;
a first mounted component mounted on said mount surface;
a second mounted component mounted on said mount surface and spaced from said first mounted component; and
at least one first embedded electronic component chip disposed in said resin substrate,
said first embedded electronic component chip being located close to the peripheral surface of said resin substrate,
said mount surface including:
a first region located between said first mounted component and said second mounted component and extending in a cross direction crossing an arrangement direction in which said first mounted component and said second mounted component are arranged with respect to each other; and
a second region located outside said first region,

said first embedded electronic component chip being arranged to extend in said first region and said second region as viewed in a direction perpendicular to said mount surface,
wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component,
wherein at least one of the first mounted component and the second mounted component comprises a chip component,
wherein said resin substrate has a lower surface located opposite to said mount surface, and
wherein said first embedded electronic component chip is located relatively closer to said mount surface than to said lower surface.

5. The component-embedded substrate according to claim 1 , wherein said first embedded electronic component chip includes a third electronic component chip and a fourth electronic component chip located relatively closer to said mount surface as compared with said third electronic component chip.

6. The component-embedded substrate according to claim 5 , wherein said fourth electronic component chip is larger in size than said third electronic component chip.

7. The component-embedded substrate according to claim 1 , wherein said first embedded electronic component chip is larger in size than said second embedded electronic component chip.

8. The component-embedded substrate according to claim 1 , wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component.

9. The component-embedded substrate according to claim 1 , wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component.

10. The component-embedded substrate according to claim 2 , wherein said first embedded electronic component chip is located relatively closer to the peripheral surface of said resin substrate as compared with said first mounted component and said second mounted component.

11. The component-embedded substrate according to claim 1 , wherein
said peripheral surface includes a first side surface and a second side surface opposite to said first side surface, said first and second side surfaces being located with respect to each other along said cross direction, and
said first embedded electronic component chip includes a first electronic component located relatively closer to said first side surface as comp

Assignees

• Murata Manufacturing Co

Inventors

• Adachi Toshiro

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/188 Primary

  manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component · CPC title

• H05K3/4069

  for via connections in organic insulating substrates · CPC title