Circuit board and method for producing same

Patent metadata

Field	Value
Publication number	US-9832889-B2
Application number	US-201514623769-A
Country	US
Kind code	B2
Filing date	Feb 17, 2015
Priority date	Feb 14, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and subjecting the stacked base sheets to compression bonding. The at least one uneven portion is provided on one of the base sheets. The uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in the predetermined direction. The convex portion protrudes in an opposite direction to the predetermined direction.

First claim

What is claimed is:

1. A circuit board, comprising:
a main portion including a plurality of base sheets stacked in a predetermined direction;
at least one uneven portion on at least one of the base sheets;
an internal component provided in the main portion; and
an auxiliary member including a strip-shaped sheet member provided between the internal component and one of the plurality of base sheets on which the at least one uneven portion is provided; wherein
the at least one uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction;
each of the concave portion and convex portion of the at least one uneven potion has a strip-shape when viewed in the predetermined direction;
the concave portion is sunken in the predetermined direction;
the convex portion protrudes in an opposite direction to the predetermined direction;
an outline of the internal component is within an outline of the at least one uneven portion when viewed in a plan view in the predetermined direction;
the at least one uneven portion is located on a side of the one of the plurality of base sheets that is farther away from the internal component in the predetermined direction; and
the auxiliary member overlaps with the convex portion when viewed in the predetermined direction.

2. The circuit board according to claim 1 , wherein
the main portion includes two opposite principal surfaces in the predetermined direction; and
a position of the uneven portion in the predetermined direction is closer to the internal component than to one of the principal surfaces.

3. The circuit board according to claim 1 , wherein the auxiliary member has a higher softening initiation temperature than the plurality of base sheets.

4. The circuit board according to claim 1 , wherein conductors are provided on at least some of the base sheets.

5. The circuit board according to claim 4 , further comprising via-conductors extending through the base sheets.

6. The circuit board according to claim 1 , wherein the internal component is an IC chip.

7. The circuit board according to claim 1 , further comprising a surface mount component that is one of an IC chip and a passive component.

8. A circuit board, comprising:
a main portion including a plurality of base sheets stacked in a predetermined direction;
at least one uneven portion on at least one of the base sheets; and
an internal component provided in the main portion; wherein
the at least one uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction;
each of the concave portion and convex portion of the at least one uneven potion has a strip-shape when viewed in the predetermined direction;
the concave portion is sunken in the predetermined direction;
the convex portion protrudes in an opposite direction to the predetermined direction;
an outline of the internal component is within an outline of the at least one uneven portion when viewed in a plan view in the predetermined direction;
the at least one uneven portion includes a first uneven portion and a second uneven portion;
the first uneven portion is located on one side of the internal component in the predetermined direction;
the second uneven portion is located on another side of the internal component in the opposite direction to the predetermined direction;
each of the concave portion and the convex portion of the first uneven potion has a strip-shape when viewed in the predetermined direction;
each of the concave portion and the convex portion of the second uneven potion has a strip-shape when viewed in the predetermined direction; and
an extending direction of the concave portion and the convex portion of the first uneven portion is perpendicular or substantially perpendicular to an extending direction of the concave portion and the convex portion of the second uneven portion.

Assignees

• Murata Manufacturing Co

Inventors

• Yosui Kuniaki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K2201/09781

  Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components · CPC title

• Y10T29/49126

  Assembling bases · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title