Electronic component, method for manufacturing the electronic component, and circuit board

Patent metadata

Field	Value
Publication number	US-9854685-B2
Application number	US-201514838562-A
Country	US
Kind code	B2
Filing date	Aug 28, 2015
Priority date	Apr 26, 2013
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.

First claim

What is claimed is:

1. An electronic component comprising:
a surface mount element including a terminal electrode; and
a circuit board on which the surface mount element is mounted; wherein
the circuit board includes:
a flat film member including a mount electrode ultrasonically welded to the terminal electrode;
a base member to which the flat film member is bonded;
a via hole conductor provided in one of the base member and the flat film member; and
a pad conductor provided at the other of the base member and the flat film member;

an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
the flat film member includes an insulating member in contact with the mount electrode; and
the flat film member has a dielectric constant different from that of the base member, and is provided with a functional conductor defining a high-frequency component.

2. An electronic component comprising:
a surface mount element including a terminal electrode; and
a circuit board on which the surface mount element is mounted; wherein
the circuit board includes:
a flat film member including a mount electrode ultrasonically welded to the terminal electrode;
a base member to which the flat film member is bonded;
a via hole conductor provided in one of the base member and the flat film member; and
a pad conductor provided at the other of the base member and the flat film member;

an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
the flat film member includes an insulating member in contact with the mount electrode; and
the flat film member has magnetic permeability different from that of the base member, and is provided with a functional conductor defining a magnetic component.

3. An electronic component comprising:
a surface mount element including a terminal electrode; and
a circuit board on which the surface mount element is mounted; wherein
the circuit board includes:
a flat film member including a mount electrode ultrasonically welded to the terminal electrode; and
a base member to which the flat film member is bonded;

an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
the base member includes a recessed portion and a raised portion in one principal surface thereof; and
an end portion of the flat film member is embedded in the raised portion.

4. The electronic component according to claim 3 , wherein the surface mount element is contained in the recessed portion.

5. The electronic component according to claim 3 , wherein the flat film member includes a pad conductor in a surface thereof where the mount electrode is provided, the pad conductor is embedded in the raised portion, and the mount electrode is electrically connected to the base member through the pad conductor.

6. The electronic component according to claim 3 , wherein the flat film member has a dielectric constant different from that of the base member, and is provided with a functional conductor defining a high-frequency component.

7. The electronic component according to claim 3 , wherein the flat film member has magnetic permeability different from that of the base member, and is provided with a functional conductor defining a magnetic component.

8. The electronic component according to claim 3 , wherein
the surface mount element is an image sensor integrated circuit; and
the electronic component defines a camera module including the image sensor integrated circuit and a lens unit optically connected to the image sensor integrated circuit.

9. A method for manufacturing the electronic component according to claim 3 , comprising:
placing the surface mount element on the flat film member included in the circuit board; and
ultrasonically welding the terminal electrode to the mount electrode.

10. A circuit board comprising:
a flat film member including a mount electrode;
a base member to which the flat film member is bonded;
a via hole conductor provided in one of the base member and the flat film member; and
a pad conductor provided at the other of the base member and the flat film member; wherein
an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
the flat film member includes an insulating member in contact with the mount electrode;
the base member includes a recessed portion and a raised portion in one principal surface thereof; and
an end portion of the flat film member is embedded in the raised portion, and the mount electrode is exposed from a portion of the flat film member provided at the recessed portion.

11. The circuit board according to claim 10 , wherein the flat film member includes the pad conductor in a surface thereof where the mount electrode is provided, the pad conductor is embedded in the raised portion, and the mount electrode is electrically connected to the base member through the pad conductor.

12. A circuit board comprising:
a flat film member including a mount electrode;
a base member to which the flat film member is bonded;
a via hole conductor provided in one of the base member and the flat film member; and
a pad conductor provided at the other of the base member and the flat film member; wherein
an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
the flat film member includes an insulating member in contact with the mount electrode; and
the flat film member has a dielectric constant different from that of the base member, and is provided with a functional conductor defining a high-frequency component.

13. A circuit board comprising:
a flat film member including a mount electrode;
a base member to which the flat film member is bonded;
a via hole conductor provided in one of the base member and the flat film member; and
a pad conductor provided at the other of the base member and the flat film member; wherein
an elastic modulus of the flat film member is higher than an elastic modulus of the base member;
the via hole conductor is directly bonded to the pad conductor, and the mount electrode is electrically connected to the base member through the via hole conductor and the pad conductor;
the flat film member includes an insulating member in contact with the mount electrode; and
the flat film member has magnetic permeability different from that of the base member, and is provided with a functional conductor defining a magnetic component.

Assignees

• Murata Manufacturing Co

Inventors

• Ikemoto Nobuo
• Osamura Makoto
• Sasaki Satoshi
• Wakabayashi Yuki

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07233

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title