Antenna device and wireless communication apparatus

Patent metadata

Field	Value
Publication number	US-9705193-B2
Application number	US-201615299888-A
Country	US
Kind code	B2
Filing date	Oct 21, 2016
Priority date	Aug 9, 2012
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A plurality of first linear sections in a coil conductor are disposed on a lower surface of a first resin sheet. A plurality of second linear sections in the coil conductor are disposed on an upper surface of a second resin sheet. A plurality of via conductors in the coil conductor are disposed in the resin sheets. The coil conductor including the linear sections and the via conductors constitutes an antenna section. A first ground conductor is disposed on the lower surface of a third resin sheet. A second ground conductor is disposed on the upper surface of a fourth resin sheet. The first ground conductor and the second ground conductor are connected to each other by a interlayer connection conductor including a plurality of via conductors. The interlayer connection conductor does not define a closed loop surrounding the coil conductor.

First claim

What is claimed is:

1. An antenna device comprising:
a multilayer substrate including a plurality of dielectric or magnetic sheets stacked on each other in a stacking direction;
a coil conductor including a coil winding axis perpendicular or substantially perpendicular to the stacking direction, a first principal surface, a second principal surface, a first side surface parallel or substantially parallel to the coil winding axis, and a second side surface parallel or substantially parallel to the coil winding axis;
an electronic component mounted on an upper surface of the multilayer substrate; and
an interlayer connection conductor separate from the coil conductor and electrically connected to the electronic component; wherein
the electronic component is mounted in a location that overlaps the coil conductor as seen from the stacking direction;
at least a portion of the interlayer connection conductor is disposed in one of the plurality of dielectric or magnetic sheets that includes at least a portion of the coil conductor;
the interlayer connection conductor is located between the first side surface and a side surface of the multilayer substrate closest to the first side surface; and
the interlayer connection conductor is not disposed in any of the plurality of dielectric or magnetic sheets that include any portion of the coil conductor between the second side surface and a side surface of the multilayer substrate closest to the second side surface.

2. The antenna device according to claim 1 , wherein the interlayer connection conductor is linear or substantially linear.

3. The antenna device according to claim 1 , wherein the multilayer substrate is a multilayer body including resin sheets, and the antenna device includes a magnetic body arranged inside a coil defined by the coil conductor.

4. The antenna device according to claim 1 , wherein the electronic component is electrically connected to the coil conductor.

5. The antenna device according to claim 1 , further comprising additional electronic components that are mounted in unevenly distributed locations other than a portion near or adjacent to the second side surface.

6. The antenna device according to claim 1 , further comprising a coil electromagnetically coupled to the coil conductor and generating an electromagnetic field.

7. A wireless communication apparatus comprising:
an antenna device including:
a multilayer substrate including a plurality of dielectric or magnetic sheets stacked on each other in a stacking direction;
a coil conductor including a coil winding axis perpendicular or substantially perpendicular to the stacking direction, a first principal surface, a second principal surface, a first side surface parallel or substantially parallel to the coil winding axis, and a second side surface parallel or substantially parallel to the coil winding axis;
an electronic component mounted on an upper surface of the multilayer substrate; and
an interlayer connection conductor separate from the coil conductor and electrically connected to the electronic component; wherein
the electronic component is mounted in a location that overlaps the coil conductor as seen from the stacking direction;
at least a portion of the interlayer connection conductor is disposed in one of the plurality of dielectric or magnetic sheets that includes at least a portion of the coil conductor;
the interlayer connection conductor is located between the first side surface and a side surface of the multilayer substrate closest to the first side surface; and
the interlayer connection conductor is not disposed in any of the plurality of dielectric or magnetic sheets that include any portion of the coil conductor between the second side surface and a side surface of the multilayer substrate closest to the second side surface; and

a communication circuit connected to the coil conductor.

8. The wireless communication apparatus according to claim 7 , wherein the interlayer connection conductor is linear or substantially linear.

Assignees

• Murata Manufacturing Co

Inventors

• Gouchi Naoki
• Yosui Kuniaki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01Q7/06 Primary

  with core of ferromagnetic material (H01Q7/02 takes precedence) · CPC title

• H05K2201/086

  for inductive purposes, e.g. printed inductor with ferrite core · CPC title

• H01Q1/36

  Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) · CPC title

• H05K1/165

  incorporating printed inductors · CPC title