Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board

Patent metadata

Field	Value
Publication number	US-2016234935-A1
Application number	US-201615015551-A
Country	US
Kind code	A1
Filing date	Feb 4, 2016
Priority date	Feb 6, 2015
Publication date	Aug 11, 2016
Grant date	—

Abstract

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

First claim

1 . A copper foil provided with a carrier comprising, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein at least one of the following (a) and (b) is satisfied:
(a) a specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less; (b) a specular gloss at 60° in a TD direction of the intermediate layer side surface of the ultrathin copper layer is 65 or less.

2 . The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in an MD direction of the intermediate layer side surface is 130 or less.

3 . The copper foil provided with a carrier according to claim 2 , wherein a specular gloss at 60° in an MD direction of the intermediate layer side surface is 120 or less.

4 . The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in a TD direction of the intermediate layer side surface of the ultrathin copper layer is 60 or less.

5 . The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in a TD direction of the intermediate layer side surface of the ultrathin copper layer is 55 or less.

6 . The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in an MD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 1.5 μm or less.

7 . The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in an MD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 0.80 μm or more.

8 . The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in a TD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 1.7 μm or less.

9 . The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer/a specular gloss at 60° in a TD direction of the intermediate layer side surface of the ultrathin copper layer is 2.05 or less.

10 . The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in an MD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter/a ten point average roughness Rz in a TD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 0.55 or more.

11 . The copper foil provided with a carrier according to claim 1 comprising:
one or more layers selected from the group consisting of a roughened layer, a heat resistant layer, an anti-corrosion layer, a chromate-treated layer, and a silane coupling-treated layer,
in the case that the copper foil provided with a carrier according to claim 1 comprises an ultrathin copper layer on one side of the carrier, on at least one surface or both surfaces on the ultrathin copper layer side and the carrier side; or
in the case that the copper foil provided with a carrier according to claim 1 comprises an ultrathin copper layer on both sides of the carrier, on one or both surface(s) on the ultrathin copper layer side.

12 . The copper foil provided with a carrier according to claim 11 , wherein the roughened layer is a layer consisting of a simple substance selected from the group consisting of copper, nickel, cobalt, phosphorous, tungsten, arsenic, molybdenum, chromium, and zinc, or an alloy comprising one or more thereof.

13 . The copper foil provided with a carrier according to claim 11 comprising a resin layer provided above one or more layers selected from the group consisting of the roughened layer, the heat resistant layer, an anti-corrosion layer, a chromate-treated layer, and a silane coupling-treated layer.

14 . The copper foil provided with a carrier according to claim 1 comprising a resin layer provided above the ultrathin copper layer.

15 . The copper foil provided with a carrier according to claim 13 , wherein the resin layer is a resin for adhesion and/or a resin in a semi-cured state.

16 . A laminate fabricated using a copper foil provided with a carrier according to claim 1 .

17 . A laminate comprising a copper foil provided with a carrier according to claim 1 and a resin, wherein a part or all of an edge face of the copper foil provided with a carrier is covered with the resin.

18 . A laminate, wherein one copper foil provided with a carrier according to claim 1 is laminated from the carrier side or the ultrathin copper layer side on the carrier side or the ultrathin copper layer side of another copper foil provided with a carrier according to claim 1 .

19 . A printed wiring board fabricated using a copper foil provided with a carrier according to claim 1 .

20 . An electronic device fabricated using a printed wiring board according to claim 19 .

21 . A method for fabricating a printed wiring board comprising:
forming a copper-clad laminate by carrying out a step of preparing a copper foil provided with a carrier according to claim 1 and an insulating substrate, a step of laminating the copper foil provided with a carrier and the insulating substrate, and a step of, after the copper foil provided with a carrier and the insulating substrate have been laminated, peeling the carrier of the copper foil provided with a carrier; and then forming a circuit by any of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method.

22 . A method for fabricating a printed wiring board comprising:
a step of forming a circuit on the ultrathin copper layer side surface or the carrier side surface of a copper foil provided with a carrier according to claim 1 ; a step of forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil provided with a carrier so that the circuit is buried; a step of forming a circuit on the resin layer; a step of peeling the carrier or the ultrathin copper layer after forming the circuit on the resin layer; and a step of exposing the circuit buried in the resin layer that is formed on the ultrathin copper layer side surface or the carrier side surface by, after the carrier or the ultrathin copper layer has been peeled off, removing the ultrathin copper layer or the carrier.

23 . A method for fabricating a printed wiring board comprising:
a step of laminating the ultrathin copper layer side surface or the carrier side surface of a copper foil provided with a carrier according to claim 1 and a resin substrate; a step of providing two layers of a resin layer and a circuit at least one time on the ultrathin copper layer side surface or the carrier side surface of the copper foil provided with a carrier opposite to a side with the resin substrate laminated thereon; and a step of, after the two layers of the resin layer and the circuit have been formed, peeling the carrier or the ultrathin copper layer from the copper foil provided with a carrier.

24 . A method for fabricating a printed wiring board comprising:
a step of providing two layers of a resin layer and a circuit at least one time on one side or both sides of a lami

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Kohiki Michiya

Classifications

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K2203/0152

  Temporary metallic carrier, e.g. for transferring material · CPC title

• H05K2201/09509

  Blind vias, i.e. vias having one side closed · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title

• H05K3/421

  Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence) · CPC title