Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board

Patent metadata

Field	Value
Publication number	US-2016353581-A1
Application number	US-201415039464-A
Country	US
Kind code	A1
Filing date	Nov 27, 2014
Priority date	Nov 27, 2013
Publication date	Dec 1, 2016
Grant date	—

Abstract

A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.

First claim

1 . A carrier-attached copper foil having a carrier, an intermediate layer and an ultra-thin copper layer in this order,
wherein a surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 85% or more, and the ultra-thin copper layer can be detached from the carrier by peeling.

2 . The carrier-attached copper foil according to claim 1 , wherein the surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 87% or more.

3 . The carrier-attached copper foil according to claim 2 , wherein the surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 90% or more.

4 . The carrier-attached copper foil according to claim 3 , wherein the surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 91% or more.

5 . The carrier-attached copper foil according to claim 4 , wherein the surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 92% or more.

6 . The carrier-attached copper foil according to claim 5 , wherein the surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 93% or more.

7 . The carrier-attached copper foil according to claim 6 , wherein the surface of the ultra-thin copper layer has an absorbance of light at a wavelength of 400 nm of 95% or more.

8 . The carrier-attached copper foil according to claim 1 , wherein an average value of surface roughness Rz of the ultra-thin copper layer is 1.7 μm or less, as measured by a laser microscope in accordance with JIS B0601-1994.

9 . (canceled)

10 . The carrier-attached copper foil according to claim 1 , having a roughened layer on at least one surface or both surfaces of the ultra-thin copper layer and the carrier.

11 . The carrier-attached copper foil according to claim 10 , wherein the roughened layer is a layer formed of an element selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium and zinc or an alloy containing at least one of these.

12 . The carrier-attached copper foil according to claim 10 , comprising a resin layer on a surface of the roughened layer.

13 . The carrier-attached copper foil according to claim 10 , having at least one layer selected from the group consisting of a heat-resistant layer, a rustproofing layer, a chromate treated layer and a layer treated with a silane coupling agent on a surface of the roughened layer.

14 . The carrier-attached copper foil according to claim 1 , having at least one layer selected from the group consisting of a heat-resistant layer, a rustproofing layer, a chromate treated layer and a layer treated with a silane coupling agent on at least one surface or both surfaces of the ultra-thin copper layer and the carrier.

15 . The carrier-attached copper foil according to claim 13 , comprising a resin layer on the at least one layer selected from the group consisting of a heat-resistant layer, a rustproofing layer, a chromate treated layer and a layer treated with a silane coupling agent.

16 . The carrier-attached copper foil according to claim 1 , comprising a resin layer on the ultra-thin copper layer.

17 - 22 . (canceled)

23 . A method for manufacturing a printed wiring board by using the carrier-attached copper foil according to claim 1 .

24 . A method for manufacturing a printed wiring board, comprising:
a step of preparing the carrier-attached copper foil according to claim 1 and an insulating substrate being dry film, resist or photo-curable resin, a step of laminating the carrier-attached copper foil and the insulating substrate, a step of forming a copper-clad laminate by detaching carrier from the carrier-attached copper foil after the carrier-attached copper foil and the insulating substrate are laminated, and thereafter, a step of forming a circuit by any one of a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method, wherein the circuit is formed by using a light exposure operation and a development operation to the dry film, the resist or the photo-curable resin.

25 . A method for manufacturing a printed wiring board, comprising:
a step of forming a circuit on the surface of the ultra-thin copper layer of the carrier-attached copper foil according to claim 1 by providing a resist on the surface of the ultra-thin copper layer and conducting a light exposure operation and a development operation to the resist, a step of forming a resin layer on the surface of the ultra-thin copper layer of the carrier-attached metal foil so as to bury the circuit, a step of forming a circuit on the resin layer a step of detaching the carrier after the circuit is formed on the resin layer, and a step of exposing the circuit buried in the resin layer and formed on the surface of the ultra-thin copper layer by removing the ultra-thin copper layer after the carrier is detached.

26 . The method for manufacturing a printed wiring board according to claim 25 , wherein the step of forming a circuit on the resin layer is a step of bonding another carrier-attached copper foil to the resin layer from the side of the ultra-thin copper layer and forming the circuit using the carrier-attached copper foil bonded to the resin layer.

27 - 28 . (canceled)

29 . The method for manufacturing a printed wiring board according to claim 25 , further comprising a step of forming a substrate on the surface of the carrier of the carrier-attached copper foil before detaching the carrier.

30 . The carrier-attached copper foil according to claim 7 , wherein an average value of surface roughness Rz of the ultra-thin copper layer is 1.7 μm or less, as measured by a laser microscope in accordance with JIS B0601-1994.

31 . The carrier-attached copper foil according to claim 14 , comprising a resin layer on the at least one layer selected from the group consisting of a heat-resistant layer, a rustproofing layer, a chromate treated layer and a layer treated with a silane coupling agent.

32 . A method for manufacturing a copper-clad laminate by using the carrier-attached copper foil according to claim 1 .

33 . A copper-clad laminate comprising the carrier-attached copper foil according to claim 1 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Nagaura Tomota

Classifications

• H05K3/205 Primary

  using a pattern electroplated or electroformed on a metallic carrier · CPC title

• H05K3/027

  the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · CPC title

• H05K2201/0355

  Metal foils · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title