Printed wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9510450-B2
Application number	US-201514799887-A
Country	US
Kind code	B2
Filing date	Jul 15, 2015
Priority date	Jul 15, 2014
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A printed wiring board includes a insulation layer, a first conductive layer embedded into first surface of the insulation layer and having surface exposed on the first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer and protruding from the second surface of the insulation layer, a via penetrating through the insulation layer and electrically connecting the first and second conductive layers, a solder-resist layer covering the first conductive layer and having an opening structure forming an exposed structure of the first conductive layer, and a metal layer formed on the exposed structure and protruding from the first surface of the insulation layer. The exposed structure of the first conductive layer includes pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface.

First claim

What is claimed is:

1. A printed wiring board, comprising:
a resin insulation layer;
a first conductive layer formed on a first-surface side of the resin insulation layer such that the first conductive layer is embedded into a first surface of the resin insulation layer and has a surface exposed on the first surface of the resin insulation layer;
a second conductive layer formed on a second-surface side of the resin insulation layer such that the second conductive layer is formed on a second surface of the resin insulation layer and is protruding from the second surface of the resin insulation layer;
a via conductor formed in the resin insulation layer such that the via conductor is penetrating through the resin insulation layer and electrically connecting the first conductive layer and the second conductive layer;
a solder-resist layer formed on the first surface of the resin insulation layer such that the solder-resist layer is covering the first conductive layer and has an opening structure forming an exposed structure of the first conductive layer; and
a metal layer formed on the exposed structure of the first conductive layer such that the metal layer is protruding from the first surface of the resin insulation layer,
wherein the exposed structure of the first conductive layer comprises a plurality of pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface and has a side surface formed such that at least a portion of the side surface is receded inward with respect to a side surface of the solder layer.

2. A printed wiring board according to claim 1 , wherein the metal layer is one of a copper foil and a nickel foil, and the first conductive layer is an electrolytic copper plated film.

3. A printed wiring board according to claim 2 , wherein the metal layer is formed on the surface of the first conductive layer such that the metal layer has an entire surface facing the first conductive layer in contact with the pads of the first conductive layer.

4. A printed wiring board according to claim 2 , wherein the metal layer is formed on the surface of the first conductive layer such that the metal layer has a surface facing the first conductive layer and having a plurality of portions in contact with the pads of the first conductive layer, respectively.

5. A printed wiring board according to claim 2 , wherein the metal layer is formed on the surface of the first conductive layer such that the metal layer has a surface facing the first conductive layer and having a plurality of portions in contact with the pads of the first conductive layer, respectively, and covering an entire surface of the exposed structure of the first conductive layer.

6. A printed wiring board according to claim 2 , wherein the metal layer has a thickness which is less than a thickness of the solder-resist layer.

7. A printed wiring board according to claim 1 , wherein the metal layer is formed on the surface of the first conductive layer such that the metal layer has an entire surface facing the first conductive layer in contact with the pads of the first conductive layer.

8. A printed wiring board according to claim 7 , wherein the pads of the first conductive layer have recessed surface portions around the metal layer, respectively.

9. A printed wiring board according to claim 8 , wherein the metal layer is one of a copper foil and a nickel foil, and the first conductive layer is an electrolytic copper plated film.

10. A printed wiring board according to claim 1 , wherein the metal layer is formed on the surface of the first conductive layer such that the metal layer has a surface facing the first conductive layer and having a plurality of portions in contact with the pads of the first conductive layer, respectively.

11. A printed wiring board according to claim 1 , wherein the metal layer is formed on the surface of the first conductive layer such that the metal layer has a surface facing the first conductive layer and having a plurality of portions in contact with the pads of the first conductive layer, respectively, and covering an entire surface of the exposed structure of the first conductive layer.

12. A printed wiring board according to claim 1 , wherein the metal layer has a thickness which is less than a thickness of the solder-resist layer.

13. A printed wiring board according to claim 1 , wherein the solder layer has an upper surface which is positioned lower than an upper surface of the solder-resist layer.

14. A printed wiring board according to claim 1 , wherein the solder layer has an upper surface which is positioned higher than an upper surface of the solder-resist layer.

15. A printed wiring board according to claim 1 , wherein the metal layer comprises a plurality of laminated metal layers.

16. A printed wiring board according to claim 1 , wherein the opening structure of the solder-resist layer comprises an opening portion exposing the plurality of pads.

17. A printed wiring board according to claim 1 , wherein the opening structure of the solder-resist layer comprises a plurality of opening portions exposing the plurality of pads, respectively.

18. A printed wiring board according to claim 1 , wherein the metal layer comprises a plurality of laminated metal layers selected from the group consisting of a Cu/Ni structure, a Cu/Ti structure, a Au/Pd/Ni structure and a Au/Ni structure.

19. A method for manufacturing a printed wiring board, comprising:
forming a first conductive layer on a metal layer formed on an entire surface of a carrier such that the first conductive layer has a plurality of pads positioned to mount an electronic component;
laminating a resin insulation layer and a metal foil on the metal layer such that the resin insulation layer covers the first conductive layer;
forming a hole for a via conductor in the resin insulation layer such that the hole penetrates through the metal foil and the resin insulation layer and exposes a portion of the first conductive layer;
forming a second conductive layer comprising the metal foil such that the hole is filled with a conductive material;
removing the carrier from the metal layer such that a surface of the metal layer is exposed;
forming a solder layer on the metal layer positioned on the plurality of pads of the first conductive layer;
etching away a portion of the metal layer by using the solder layer as a mask; and
forming a solder-resist layer on the first surface of the resin insulation layer such that the solder-resist layer has an opening structure forming an exposed structure comprising the plurality of pads of the first conductive layer.

20. A method for manufacturing a printed wiring board according to claim 19 , wherein the forming of the solder layer comprises forming a plate resist layer on the metal layer such that the plate resist layer has openings exposing portions of the metal layer corresponding to the pads, respectively, and applying solder material to the metal layer by a plating method such that the solder layer is formed on the portions of the metal layer positioned on the pads, respectively.

Assignees

• Ibiden Co Ltd

Inventors

• Furutani Toshiki
• Inagaki Yasushi

Classifications

• H05K3/103

  by bonding or embedding conductive wires or strips · CPC title

• H05K3/0017

  Etching of the substrate by chemical or physical means · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K3/0011

  Working of insulating substrates or insulating layers · CPC title