Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices

Patent metadata

Field	Value
Publication number	US-2016381806-A1
Application number	US-201615188292-A
Country	US
Kind code	A1
Filing date	Jun 21, 2016
Priority date	Jun 24, 2015
Publication date	Dec 29, 2016
Grant date	—

Abstract

The present invention provides a copper foil with a carrier including an ultra-thin copper layer having a thickness of 0.9 μm or less and capable of preferably preventing generation of pin holes during peeling of the carrier. A copper foil with a carrier including a carrier, an intermediate layer, and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer has a thickness of 0.9 μm or less, the surface close to the ultra-thin copper layer of the carrier has an arithmetic average roughness Ra of 0.3 μm or less, as measured with a laser microscope according to JIS B0601-1994, and the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 20 N/m or less.

First claim

What is claimed is:

1 . A copper foil with a carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer in this order,
wherein the ultra-thin copper layer has a thickness of 0.9 μm or less, the surface close to the ultra-thin copper layer of the carrier has an arithmetic average roughness Ra of 0.3 μm or less, as measured with a laser microscope according to JIS B0601-1994, and the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 20 N/m or less.

2 . The copper foil with a carrier according to claim 1 ,
wherein the surface close to the ultra-thin copper layer of the carrier has an arithmetic average roughness Ra of 0.1 to 0.3 μm, as measured with a laser microscope according to JIS B0601-1994.

3 . The copper foil with a carrier according to claim 1 ,
wherein the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 3 to 20 N/m.

4 . The copper foil with a carrier according to claim 2 ,
wherein the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 3 to 20 N/m.

5 . The copper foil with a carrier according to claim 1 ,
wherein the ultra-thin copper layer has a thickness of 0.05 to 0.9 μm.

6 . The copper foil with a carrier according to claim 1 ,
wherein the ultra-thin copper layer has a thickness of 0.1 to 0.9 μm.

7 . The copper foil with a carrier according to claim 1 ,
wherein the ultra-thin copper layer has a thickness of 0.85 μm or less.

8 . The copper foil with a carrier according to claim 1 ,
wherein the number of pin holes per unit area (m 2 ) of the ultra-thin copper layer (pin holes/m 2 ) is 20 pin holes/m 2 or less.

9 . The copper foil with a carrier according to claim 1 ,
wherein if the ultra-thin copper layer is disposed on one surface of the carrier in a copper foil with a carrier according to claim 1 , one or more layers selected from the group consisting of a roughened layer, a heat-resistant layer, an anti-corrosive layer, a chromate treated layer, and a silane coupling treated layer are disposed on one surface or both surfaces close to the ultra-thin copper layer and close to the carrier, or if the ultra-thin copper layer is disposed on both surfaces of the carrier in a copper foil with a carrier according to claim 1 , one or more layers selected from the group consisting of a roughened layer, a heat-resistant layer, an anti-corrosive layer, a chromate treated layer, and a silane coupling treated layer are disposed on the surface of the ultra-thin copper layer on at least one of both surfaces.

10 . The copper foil with a carrier according to claim 9 ,
wherein at least one of the anti-corrosive layer and the heat-resistant layer contains one or more elements selected from nickel, cobalt, copper, and zinc.

11 . The copper foil with a carrier according to claim 1 ,
wherein the ultra-thin copper layer has a resin layer thereon.

12 . The copper foil with a carrier according to claim 9 ,
wherein the one or more layers selected from a roughened layer, a heat-resistant layer, an anti-corrosive layer, a chromate treated layer, and a silane coupling treated layer have a resin layer thereon.

13 . The copper foil with a carrier according to claim 11 ,
wherein the resin layer contains a dielectric substance.

14 . The copper foil with a carrier according to claim 12 ,
wherein the resin layer contains a dielectric substance.

15 . A method of producing a printed wiring board using a copper foil with a carrier according to claim 1 .

16 . A method of producing a laminate using a copper foil with a carrier according to claim 1 .

17 . A laminate comprising a copper foil with a carrier according to claim 1 and a resin, wherein end surfaces of the copper foil with a carrier are partially or completely covered with the resin.

18 . A laminate comprising two copper foils with a carrier according to claim 1 , wherein the carrier or the ultra-thin copper layer of one of the copper foils with a carrier is laminated on the carrier or the ultra-thin copper layer of the other copper foil with a carrier.

19 . A method of producing a printed wiring board using a laminate produced by the method according to claim 16 .

20 . A method of producing a printed wiring board, comprising:
a step of disposing at least one layer group composed of a resin layer and a circuit on a laminate produced by the method according to claim 16 , and, a step of peeling the ultra-thin copper layer or the carrier from the copper foil with a carrier of the laminate after formation of the at least one layer group composed of a resin layer and a circuit.

21 . A method of producing a printed wiring board, comprising:
a step of providing a copper foil with a carrier according to claim 1 and an insulating substrate, a step of laminating the copper foil with a carrier on the insulating substrate, a step of peeling the copper carrier of the copper foil with a carrier to form a copper clad laminate board after lamination of the copper foil with a carrier on the insulating substrate, and a step of then forming a circuit by one of a semi-additive process, a subtractive process, a partly additive process, and a modified semi-additive process.

22 . A method of producing a printed wiring board, comprising:
a step of forming a circuit on the surface close to the ultra-thin copper layer or the carrier of a copper foil with a carrier according to claim 1 , a step of forming a resin layer on the surface close to the ultra-thin copper layer or the carrier of the copper foil with a carrier such that the circuit is embedded, a step of peeling the carrier or the ultra-thin copper layer, and a step of removing the ultra-thin copper layer or the carrier after peeling of the carrier or the ultra-thin copper layer to expose the circuit formed on the surface close to the ultra-thin copper layer or the carrier of the copper foil with a carrier and embedded in the resin layer.

23 . A method of producing a printed wiring board, comprising:
a step of laminating the surface close to the ultra-thin copper layer or the carrier of a copper foil with a carrier according to claim 1 on a resin substrate, a step of disposing at least one layer group composed of a resin layer and a circuit on the surface close to the ultra-thin copper layer or the carrier of the copper foil with a carrier opposite to the surface thereof laminated on the resin substrate, and a step of peeling the carrier or the ultra-thin copper layer from the copper foil with a carrier after formation of the at least one layer group composed of a resin layer and a circuit.

24 . A method of producing an electronic device using a printed wiring board produced by a method of producing a printed wiring board produced by the method according to claim 15 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyoshi Yoshiyuki
• Kohiki Michiya
• Nagaura Tomota

Classifications

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K1/02 Primary

  Details · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2203/0152

  Temporary metallic carrier, e.g. for transferring material · CPC title

• H05K2201/0355

  Metal foils · CPC title