Motor vehicle component support and method for the production thereof
US-9849848-B2 · Dec 26, 2017 · US
using self-supporting metal foil pattern
using self-supporting metal foil pattern · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/202 |
| Official title | {using self-supporting metal foil pattern} |
| Display label | using self-supporting metal foil pattern |
| Total patents | 243 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 26 |
| 2017 | 37 |
| 2018 | 25 |
| 2019 | 26 |
| 2020 | 27 |
| 2021 | 15 |
| 2022 | 25 |
| 2023 | 9 |
| 2024 | 15 |
| 2025 | 8 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flexible substrate including stretchable sheet
US-9844133-B2 · Dec 12, 2017 · US
Circuit board and liquid ejection head
US-9832864-B2 · Nov 28, 2017 · US
Insert-moulded lead frame and method for the production thereof
US-9808973-B2 · Nov 7, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US-2017042025-A1 · Feb 9, 2017 · US
Protection circuit module integrated cap assembly, and method of manufacturing cap assembly and secondary battery
US-9564662-B2 · Feb 7, 2017 · US
Circuit carrier and method for producing a circuit carrier
US-9559048-B2 · Jan 31, 2017 · US
Circuit board and liquid ejection head
US-2016353565-A1 · Dec 1, 2016 · US
Printed circuit board and method for manufacturing the same
US-9497853-B2 · Nov 15, 2016 · US
Substrate structures and methods of manufacture
US-2016323997-A1 · Nov 3, 2016 · US
Substrate structures and methods of manufacture
US-2016324008-A1 · Nov 3, 2016 · US
Wiring substrate and manufacturing method thereof
US-9480142-B2 · Oct 25, 2016 · US
Method of manufacturing a circuit board by punching
US-9478674-B2 · Oct 25, 2016 · US
Plastic molding compound and use thereof
US-2016295705-A1 · Oct 6, 2016 · US
Electric module, electrical system comprising such an electric module, and corresponding production methods
US-2016255745-A1 · Sep 1, 2016 · US
Substrate for light emitting device, light emitting device, and method for manufacturing substrate for light emitting device
US-2016233401-A1 · Aug 11, 2016 · US
Substrate structures and methods of manufacture
US-9408301-B2 · Aug 2, 2016 · US
Laminated electrical trace within an LED interconnect
US-9406855-B2 · Aug 2, 2016 · US
Transfer method for manufacturing conductor structures by means of nano-inks
US-9403211-B2 · Aug 2, 2016 · US
Insert-Moulded Lead Frame and Method for the Production Thereof
US-2016214292-A1 · Jul 28, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/202?
- CPC H05K3/202 is the Cooperative Patent Classification code for “using self-supporting metal foil pattern.”
- How many patents are filed under CPC H05K3/202 (using self-supporting metal foil pattern)?
- Our database includes 243 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/202 growing?
- Publication counts under this code: 15 in 2024 vs 8 in 2025 (latest complete years).