Insert-moulded lead frame and method for the production thereof

Patent metadata

Field	Value
Publication number	US-9808973-B2
Application number	US-201414916186-A
Country	US
Kind code	B2
Filing date	Aug 1, 2014
Priority date	Sep 3, 2013
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.

First claim

The invention claimed is:

1. An insert-molded lead frame, comprising:
a core element with a plurality of elongate conductor tracks arranged next to one another;
first partial insert-moldings formed by a first insert molding of the core element on first partial regions of the core element;
second partial insert-moldings formed by a second insert molding of the core element on second partial regions of the core element;
wherein the first partial insert-moldings and the second partial insert-moldings together form a complete insert-molding that completely encases the core element,
wherein the first partial insert-moldings are outwardly exposed through an uppermost outer surface of the complete insert-molding,
wherein adjacent first partial regions are spaced apart from one another, and
wherein each of the first partial insert-moldings surrounds only one individual conductor track.

2. The insert-molded lead frame as claimed in claim 1 , wherein the first partial insert-moldings are coextensive with the uppermost outer surface of the complete insert-molding.

3. A method for the production of a lead frame, comprising:
forming first partial insert-moldings on first partial regions of a core element, the core element including a plurality of elongate conductor tracks arranged next to one another;
forming second partial insert-moldings on second partial regions of the core element,
wherein the first partial insert-moldings and the second partial insert-moldings together form a complete insert-molding that completely encases the core element,
wherein adjacent first partial regions are spaced apart from one another, and each of the first partial insert-moldings surrounds only one individual conductor track, and
wherein the first partial insert-moldings are formed on the first partial regions of the core element by local insert molding of a plurality of adjacent conductor tracks and subsequent interruption of a retaining insert-molding formed in such a manner in regions between adjacent conductor tracks.

4. The method as claimed in claim 3 , wherein the retaining insert-molding is interrupted in regions between adjacent conductor tracks before the second partial insert-moldings are formed.

5. The method as claimed in claim 3 , wherein the retaining insert-molding is interrupted in regions between adjacent conductor tracks after the second partial insert-moldings are formed.

6. The method as claimed in claim 3 , wherein a stabilizing insert-molding connecting a plurality of conductor tracks of the core element is formed on end regions of the core element before the second partial insert-moldings are formed.

7. A transmission control device, comprising:
an insert-molded lead frame including:
a core element with a plurality of elongate conductor tracks arranged next to one another;
first partial insert-moldings formed by a first insert molding of the core element on first partial regions of the core element; and

second partial insert-moldings formed by a second insert molding of the core element on second partial regions of the core element,
wherein the first partial insert-moldings and the second partial insert-moldings together form a complete insert-molding that completely encases the core element, and

wherein adjacent first partial regions are spaced apart from one another,
wherein the first partial insert-moldings are outwardly exposed through an uppermost outer surface of the complete insert-molding, and
wherein each of the first partial insert-moldings surrounds only one individual conductor track.

Assignees

• Bosch Gmbh Robert

Inventors

• Gerhaeusser Martin
• Barone Giuseppe

Classifications

• H10W70/451

  Multilayered leadframes · CPC title

• H10W70/421

  Shapes or dispositions · CPC title

• H10W70/04

  of leadframes · CPC title

• B29L2031/3493

  Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces · CPC title

• B29K2995/0007

  Insulating · CPC title