Wiring substrate and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9480142-B2
Application number	US-201414289401-A
Country	US
Kind code	B2
Filing date	May 28, 2014
Priority date	Jun 3, 2010
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

First claim

What is claimed is:

1. A wiring substrate comprising:
a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components;
a window section formed in the substrate;
and a connection terminal extended from and protruding within an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate, the inside surface portion being perpendicular to the front and rear surface of the substrate, a portion of the connection terminal protruding within the inside surface portion being completely surrounded by the substrate,
wherein the window section has a predetermined height in the direction perpendicular to the surface of the substrate,
wherein the portion of the connection terminal protrudes from the window section at a position which is substantially at a center of the predetermined height,
wherein the window section is a continuous opening, throughout the substrate, from the front surface to the rear surface, and
wherein the window section is formed entirely within the substrate such that all sides of the window section are surrounded by a portion of the substrate extending from the front surface to the rear surface at the predetermined height.

2. The wiring substrate according to claim 1 , wherein the substrate includes a metal core substrate in which insulation layers are formed on the front and rear of a metal core which is the high thermal conductive layer.

3. The wiring substrate according to claim 1 , wherein a bending portion of the connection terminal is a curved section which bends in an arc shape when seen from a side surface thereof.

4. The wiring substrate according to claim 1 , wherein a plurality of the connection terminals are installed in the inside surface portion of the window section in a longitudinal direction, and at least two connection terminals of the plurality of the connection terminals are electrically connected with each other inside the substrate.

5. The wiring substrate according to claim 1 , wherein the high thermal conductive layer and the connection terminal are formed in the same layer.

6. The wiring substrate according to claim 1 , wherein the connection terminal is connected to another wiring substrate which is installed in parallel at an interval with respect to the substrate.

Assignees

• Yazaki Corp

Inventors

• Harao Akira
• Matsunaga Mototatsu
• Sugiura Yasuhiro
• Kubota Minoru

Classifications

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W70/479

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H01R12/728 Primary

  Coupling devices without an insulating housing provided on the edge of the PCB · CPC title