Transfer method for manufacturing conductor structures by means of nano-inks

US9403211B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9403211-B2
Application numberUS-201113642006-A
CountryUS
Kind codeB2
Filing dateApr 19, 2011
Priority dateApr 20, 2010
Publication dateAug 2, 2016
Grant dateAug 2, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for providing a foil material with at least one electrically conductive conductor structure, comprising the steps: (a) applying a dispersion, containing metallic nanoparticles, in a form which corresponds to the form of the conductor structure to be formed, to a surface of a transfer material to provide a precursor conductor structure formed by the nanoparticles, (b) sintering the metallic nanoparticles forming the precursor conductor structure by supplying heat to the nanoparticles so as to form the electrically conductive conductor structure on the surface of the transfer material, (c) bringing into contact a surface of the foil material and the surface of the transfer material on which the electrically conductive conductor structure is located, (d) transferring the electrically conductive conductor structure from the surface of the transfer material onto the contacting surface of the foil material by exerting pressure, and (e) detaching segments of a desired size from the foil material, a segment having at least one electrically conductive conductor structure, wherein the steps (c), (d) and (e) are carried out immediately subsequent to the steps (a) and (b) or at any later point in time. 2. The method according to claim 1 , wherein the transfer material comprises a band composed of metal or of a high-temperature-resistant plastic or of a material coated with a high-temperature-resistant plastic. 3. The method according to claim 1 , wherein, the transfer material comprises a roller composed of metal or of a high-temperature-resistant plastic or a roller coated with a high-temperature-resistant plastic or metal. 4. The method according to claim 1 , wherein the dispersion containing nanoparticles is an aqueous dispersion or a solvent-based dispersion with a content of nanoparticles of 10 wt % to 30 wt % and/or with an average particle diameter of the nanoparticles of 20 nm to 1000 nm, wherein the nanoparticles are particles of pure metals or of metal alloys. 5. The method according to claim 1 , further comprising applying the dispersion containing metallic nanoparticles using a printing method. 6. The method according to claim 1 , further comprising sintering the nanoparticles forming the precursor conductor structure into the electrically conductive conductor structure at a temperature of at least 150° C., and within a time of no more than 30 seconds. 7. The method according to claim 1 , wherein the foil material comprises a hot-laminatable foil material. 8. The method according to claim 1 , further comprising pretreating in adhesion-enhancing fashion or coating in adhesion-enhancing fashion the surface of the foil material to be provided with the electrically conductive conductor structure to improve the adhesion to the conductor structure and/or pretreating or coating in adhesion-reducing fashion the surface of the transfer material to reduce the adhesion to the electrically conductive conductor structure. 9. The method according to claim 1 , wherein the metallic nanoparticles comprise silver particles, aluminum particles or particles of copper-nickel alloys. 10. A method for manufacturing a laminate material which has at least a layer made of a first foil material, a layer made of a second foil material and at least one electrically conductive conductor structure between the layer made of the first foil material and the layer made of the second foil material, wherein the layer made of the first foil material and the layer made of the second foil material are electrically insulating, comprising steps: (a) applying a dispersion, containing metallic nanoparticles, in a form which corresponds to the form of the conductor structure to be formed, to a surface of a transfer material to provide a precursor conductor structure formed by the nanoparticles, (b) sintering the metallic nanoparticles forming the precursor conductor structure by supplying heat to the nanoparticles so as to form the electrically conductive conductor structure on the surface of the transfer material, (c) bringing into contact a surface of the first or the second foil materials and the surface of the transfer material on which the electrically conductive conductor structure is located, (d) transferring the electrically conductive conductor structure from the surface of the transfer material onto the contacting surface of the foil material by exerting pressure, and (e) detaching segments of a desired size from the foil material, a segment having at least one electrically conductive conductor structure, wherein the steps (c), (d) and (e) are carried out immediately subsequent to the steps (a) and (b) or at any later point in time, and arranging the first and the second foil materials on top of each other in such a way that the electrically conductive conductor structure is located between the first and the second foil materials, and connecting the first and the second foil materials. 11. The method according to claim 10 , further comprising equipping the first and the second foil materials with the conductor structure, arranging the first and the second foil materials and a third foil material on top of each other in such a way that the conductor structures are respectively located between layers made of foil material and are separated from each other by a layer made of foil material, and connecting the first, the second, and the third foil materials. 12. The method according to claim 10 , further comprising providing at least one further foil material with an electrically conductive conductor structure, arranging the first, the second and where applicable, the third foil materials, and the at least one further foil material on top of each other in such a way that the electrically conductive conductor structures are respectively located between layers made of foil material and are separated from each other by a layer made of foil material, and connecting the first, the second, the third and the at least one further foil materials. 13. The method according to claim 10 , further comprising equipping the first or the second foil materials on two surfaces with the electrically conductive conductor structure, arranging the first and the second foil materials, and a further foil material on top of each other in such a way that the electrically conductive conductor structures are respectively located between two layers made of foil material and are separated from each other by a layer made of foil material, and connecting the first, the second, and the further foil materials. 14. The method according to claim 10 , further comprising equipping a surface of the first foil material with a first and a second electrically conductive conductor structure, providing the second foil material with a third electrically conductive conductor structure, arranging the first and the second foil materials, and a further foil material on top of each other in such a way that the conductor structures are located between layers made of foil material and the first and second conductor structure are separated from each other by the further foil material, and connecting the first, the second, and the further foil materials. 15. The method according to claim 10 , wherein at least one of the layers made of foil material has a through opening, wherein the through opening allows opposing electrically conductive conductor structures to contact each other.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches · CPC title

  • Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product · CPC title

  • by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing · CPC title

  • with one or more layers not made from powder, e.g. made from solid metal · CPC title

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What does patent US9403211B2 cover?
A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sinte…
Who is the assignee on this patent?
Welling Ando, Giesecke & Devrient Gmbh
What technology area does this patent fall under?
Primary CPC classification G06K19/07345. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).