Circuit carrier and method for producing a circuit carrier

Patent metadata

Field	Value
Publication number	US-9559048-B2
Application number	US-201113236620-A
Country	US
Kind code	B2
Filing date	Sep 19, 2011
Priority date	Sep 21, 2010
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A circuit carrier is disclosed that includes a base body having two flat sides and a plurality of narrow sides, a first conductor track applied to a first flat side of the base body, and a leadframe arranged in the interior of the base body. A method for producing the circuit carrier is also disclosed.

First claim

What is claimed is:

1. A circuit carrier, comprising:
a base body having a first exterior surface, a second opposite exterior surface, and a plurality of narrow sides, the first and second exterior surfaces and the plurality of narrow sides defining an interior;
a first conductor track positioned partially on the first exterior surface; and
a leadframe arranged at least partially within the interior,
wherein the base body includes at least one cutout cut into the first exterior surface and extending from the first exterior surface into the interior to the leadframe, and
wherein a first portion of the first conductor track extends into the cutout to the leadframe to electrically connect a second portion of the first conductor track positioned on the first exterior surface to the leadframe.

2. The circuit carrier according to claim 1 , further comprising a second conductor track applied at least partially on the second exterior surface.

3. The circuit carrier according to claim 1 , wherein the base body is an integral injection-molded part.

4. The circuit carrier according to claim 1 , further comprising an electrically conductive material arranged at a hole end of the cutout so as to produce an electrical contact between the leadframe and the first portion of the first conductor track.

5. The circuit carrier according to claim 1 , wherein a partial region of the leadframe is bent over along a first narrow side of the plurality of narrow sides of the base body.

6. A method for producing a circuit carrier, comprising:
encapsulating a plate-type leadframe having two flat sides with a base body by injection molding in such a way that the leadframe is at least partly surrounded by the base body at both flat sides, the base body includes a first exterior surface, a second opposite exterior surface, and a plurality of narrow sides, and the first and second exterior surfaces and the plurality of narrow sides define an interior;
introducing cutouts into the first exterior surface extending from the first exterior surface into the interior to the leadframe;
applying a first portion of a conductor track to the first exterior surface of the base body;
applying a second portion of the conductor track in the cutouts; and
connecting the conductor track to the leadframe in an electrically conductive manner.

7. The method according to claim 6 , introducing the cutouts further comprising:
drilling the cutouts with a laser.

8. The method according to claim 6 , applying the first portion of the conductor track further comprising:
applying conductor track traces on the base body first exterior surface with a laser; and
plating the conductor track on the applied conductor track traces.

9. The method according to claim 6 , further comprising:
introducing an electrically conductive material into a hole end of the cutout so as to produce an electrical connection between the leadframe and the conductor track.

10. The method according to claim 6 , further comprising:
bending a partial region of the leadframe over at a first narrow side of the plurality of narrow sides of the base body.

11. The circuit carrier according to claim 4 , wherein the electrically conductive material is one of a conductive adhesive, a solder, and a molten metal powder.

12. The circuit carrier according to claim 5 , wherein the partial region of the leadframe is bent over by 90° at the first narrow side of the base body.

13. The method according to claim 9 , wherein the electrically conductive material is one of a conductive adhesive, a solder, and a molten metal powder.

14. The method according to claim 10 , wherein the partial region of the leadframe is bent over by 90° at the first narrow side of the base body.

15. The circuit carrier according to claim 1 , wherein partial regions of the leadframe are separated.

16. The method according to claim 6 , further comprising:
concomitantly injection-molding the cutouts during the encapsulation of the leadframe by use of correspondingly formed injection molds.

17. The method according to claim 6 , applying the first portion of the conductor track further comprising:
performing a successive 2-component injection molding process with a first, non-plateable plastic and a second, plateable plastic; and
plating the conductor track on the second, plateable plastic,
wherein one of the first, non-plateable plastic and the second, plateable plastic is injected before the other of the first, non-plateable plastic and the second, plateable plastic.

18. The circuit carrier according to claim 1 , wherein the leadframe, the first exterior surface, and the second exterior surface are defined substantially in planes that are parallel with one another.

19. The circuit carrier according to claim 1 , wherein the leadframe includes a first flat side and a second flat side, and the leadframe is arranged in the interior such that the first flat side and the second flat side are at least partially encapsulated by the interior.

Assignees

• Wahl Ruben
• Arlt Andreas
• Sundermeier Frieder
• Bosch Gmbh Robert

Inventors

• Wahl Ruben
• Arlt Andreas
• Sundermeier Frieder

Classifications

• H10W70/479 Primary

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H05K3/421

  Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence) · CPC title

• H05K2201/09563

  Metal filled via · CPC title

• H05K2201/09118

  Moulded substrate · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title