Circuit board and liquid ejection head

Patent metadata

Field	Value
Publication number	US-9832864-B2
Application number	US-201615161731-A
Country	US
Kind code	B2
Filing date	May 23, 2016
Priority date	May 27, 2015
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A liquid ejection head includes a circuit board having a wire pattern divided into a plurality of portions in order to provide the circuit board with very reliable bonding.

First claim

What is claimed is:

1. A circuit board including a plurality of connection terminals arranged along a first direction and a plurality of wire patterns connected to the respective plurality of connection terminals, a surface of the circuit board with the plurality of wire patterns formed thereon being bonded to a support member with an adhesive,
wherein each of the plurality of wire patterns includes a first portion extending from the connection terminal in a second direction crossing the first direction and a second portion extending after being bent from the first portion,
the second portion of at least one of the plurality of wire patterns is divided into a plurality of portions in a width direction crossing a direction in which the second portion extends, and
the second portion divided into the plurality of portions is a common wide portion into which the first portions of at least two of the wire patterns are brought together.

2. The circuit board according to claim 1 , wherein the plurality of wire patterns includes a first wire pattern in which the second portion has a predetermined width and a second wire pattern in which the second portion has a width larger than the predetermined width, and
the second portion of the second wire pattern is divided into a plurality of portions in the width direction.

3. The circuit board according to claim 1 , wherein the second portion divided into the plurality of portions is positioned in a bonding surface of the circuit board.

4. The circuit board according to claim 1 , wherein the second portion divided into the plurality of portions is positioned within an arrangement range of the plurality of connection terminals in the first direction.

5. The circuit board according to claim 1 , wherein the second direction is orthogonal to the first direction, and
the second portion is bent in the first direction from the first portion.

6. The circuit board according to claim 1 , wherein the plurality of connection terminals is arranged along an edge of the circuit board.

7. The circuit board according to claim 1 , wherein the circuit board is a flexible circuit board.

8. A circuit board including a plurality of connection terminals arranged along a first direction and a plurality of wire patterns connected to the respective plurality of connection terminals, a surface of the circuit board with the plurality of wire patterns formed thereon being bonded to a support member with an adhesive,
wherein each of the plurality of wire patterns includes a first portion extending from the connection terminal in a second direction crossing the first direction and a second portion extending after being bent from the first portion,
the second portion of at least one of the plurality of wire patterns is divided into a plurality of portions in a width direction crossing a direction in which the second portion extends, and
the second portion divided into the plurality of portions has a slit extending in a length direction of the second portion.

9. The circuit board according to claim 8 , wherein the slit is divided into a plurality of portions in the length direction of the second portion.

10. A liquid ejection head enabled to eject a liquid, the liquid ejection head comprising a circuit board and an element substrate, wherein
the circuit board includes a plurality of connection terminals arranged along a first direction and a plurality of wire patterns connected to the respective plurality of connection terminals, a surface of the circuit board with the plurality of wire patterns formed thereon being bonded to a support member with an adhesive,
each of the plurality of wire patterns includes a first portion extending from the connection terminal in a second direction crossing the first direction and a second portion extending after being bent from the first portion,
the second portion of at least one of the plurality of wire patterns is divided into a plurality of portions in a width direction crossing a direction in which the second portion extends,
the element substrate includes a plurality of electrode terminals connected to the plurality of connection terminals on the circuit board, and
the second portion divided into the plurality of portions is a common wide portion into which the first portions of at least two of the wire patterns are brought together.

11. A liquid ejection head enabled to eject a liquid, the liquid ejection head comprising a circuit board and an element substrate, wherein
the circuit board includes a plurality of connection terminals arranged along a first direction and a plurality of wire patterns connected to the respective plurality of connection terminals, a surface of the circuit board with the plurality of wire patterns formed thereon being bonded to a support member with an adhesive,
each of the plurality of wire patterns includes a first portion extending from the connection terminal in a second direction crossing the first direction and a second portion extending after being bent from the first portion,
the second portion of at least one of the plurality of wire patterns is divided into a plurality of portions in a width direction crossing a direction in which the second portion extends,
the element substrate includes a plurality of electrode terminals connected to the plurality of connection terminals on the circuit board, and
the second portion divided into the plurality of portions has a slit extending in a length direction of the second portion.

Assignees

• Canon Kk

Inventors

• Iri Junichiro
• Sato Ryo
• Idogawa Kazuhiro
• Muraoka Chiaki
• Amma Hiromasa
• Iwano Takuya

Classifications

• H05K2201/09663

  Divided layout, i.e. conductors divided in two or more parts · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title

• B41J2/175

  Ink supply systems {; Circuit parts therefor} · CPC title

• H05K2201/09254

  Branched layout · CPC title