Method of manufacturing a circuit board by punching

Patent metadata

Field	Value
Publication number	US-9478674-B2
Application number	US-201313896853-A
Country	US
Kind code	B2
Filing date	May 17, 2013
Priority date	Nov 19, 2010
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

First claim

What is claimed is:

1. A method of manufacturing a circuit board, comprising:
forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil;
forming adhesive layers on surfaces of the plurality of metal electrodes;
adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and
transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes, wherein
the portion of the metal foil is removed by
providing an adhesive layer between the metal foil and the holding sheet,
cutting the metal foil by punching with a punching blade while forming the plurality of metal electrodes, and
forming a detachment portion between the metal foil and the adhesive layer on a lateral side of the punching blade when cutting the metal foil, and

the forming the plurality of metal electrodes comprises
laminating the metal foil onto the adhesive layer,
separating a metal region which requires metal foil and a region which does not require metal foil in the metal foil by pushing a tip of the punching blade onto the metal foil to cut the metal foil in a cross section that is parallel to a thickness direction of the metal foil, along a separating line defined by the tip of the pushed punching blade, and by detaching a predetermined area of the metal foil whose center is the separating line from the adhesive layer,
shredding the region which does not require the metal foil by pushing a tip of the punching blade onto the region which does not require the metal foil to cut the region which does not require the metal foil in a cross section that is parallel to the thickness direction, along a shredding line defined by the tip of the pushed punching blade, and by detaching a predetermined area of the region which does not require the metal foil whose center is the shredding line from the adhesive layer, and
preliminary determining a detachment length,

the detachment length is a length of when the metal foil is detached from the adhesive layer by setting a base line as a center, the base line being defined by a tip of a pushed punching blade when the tip of the punching blade is pushed onto the metal foil, the metal foil being laminated on the adhesive layer, in a cross section that is parallel to a thickness direction of the metal foil, and
after laminating the metal foil and shredding the region which does not require the metal foil, a distance between the shredding line and the separating line in the cross section that is parallel to the thickness direction is set to be equal to or less than a value twice of the detachment length.

2. The method of manufacturing a circuit board according to claim 1 , wherein a minimum value of a distance between the separating lines adjacent to each other is larger than the detachment length at least in a portion of the region which requires the metal foil.

3. The method of manufacturing a circuit board according to claim 1 , wherein the tip of the punching blade is formed to have an acute angle.

4. The method of manufacturing a circuit board according to claim 1 , wherein the separating the region which requires the metal foil and the region which does not require the metal foil in the metal foil and the shredding the region which does not require the metal foil are performed at the same time.

Assignees

• Dsm Ip Assets Bv

Inventors

• Kumai Koichi
• Ueda Ryuji
• Kubota Kentaro
• Kudo Shigeki
• Kawasaki Minoru

Classifications

• H05K2203/0221

  Perforating · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• H05K2203/033

  Punching metal foil, e.g. solder foil · CPC title

• H05K2203/1545

  Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path · CPC title

• Y10T29/49156

  with selective destruction of conductive paths · CPC title