Protection circuit module integrated cap assembly, and method of manufacturing cap assembly and secondary battery

Patent metadata

Field	Value
Publication number	US-9564662-B2
Application number	US-201314012939-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Jan 29, 2013
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A protection circuit module (PCM) integrated cap assembly includes a cap plate including an electrically conductive material and defining a through hole passing from a first surface of the cap plate to a second surface of the cap plate, a wiring unit including an electrically conductive material and a circuit pattern, and facing the first surface of the cap plate, wherein a first edge of the wiring unit is electrically coupled to the cap plate, and wherein a second edge of the wiring unit extends through the through hole of the cap plate a first insulating unit in a space of the circuit pattern a second insulating unit between the second edge of the wiring unit and a portion of the cap plate defining the through hole, and at least one electrical component coupled to the circuit pattern.

First claim

What is claimed is:

1. A protection circuit module (PCM) integrated cap assembly comprising:
a cap plate comprising an electrically conductive material and defining a through hole passing from a first surface of the cap plate to a second surface of the cap plate;
a wiring unit comprising an electrically conductive material and a circuit pattern, and facing the first surface of the cap plate, wherein a first edge of the wiring unit is electrically coupled to the cap plate, and wherein a second edge of the wiring unit extends through the through hole of the cap plate;
a first insulating unit in a space of the circuit pattern;
a second insulating unit between the second edge of the wiring unit and a portion of the cap plate defining the through hole;
at least one electrical component coupled to the circuit pattern; and
a connection unit bent from the first edge of the wiring unit and also bent from an edge of the cap plate,
wherein the cap plate and the wiring unit are collectively formed from a single substrate.

2. The PCM integrated cap assembly of claim 1 , wherein the circuit pattern comprises an etched material.

3. The PCM integrated cap assembly of claim 1 , wherein outer corners of the cap plate comprise a curved surface.

4. The PCM integrated cap assembly of claim 1 , wherein the second edge of the wiring unit comprises a portion bent towards the cap plate.

5. The PCM integrated cap assembly of claim 4 , further comprising a terminal plate comprising an electrically conductive material and located at the second insulating unit and electrically coupled to the second edge of the wiring unit, and
wherein the second insulating unit extends to the second surface of the cap plate and surrounds the second edge of the wiring unit.

6. The PCM integrated cap assembly of claim 1 , wherein the circuit pattern comprises a plurality of terminal units exposed at a surface of the first insulating unit facing away from the cap plate.

Assignees

• Samsung Sdi Co Ltd

Inventors

• Hwang Yu-Sik

Classifications

• H01M50/159

  Metals · CPC title

• H05K3/202

  using self-supporting metal foil pattern · CPC title

• H01M50/572

  Means for preventing undesired use or discharge · CPC title

• H01M10/4257 Primary

  Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries · CPC title

• H05K2203/302

  Bending a rigid substrate; Breaking rigid substrates by bending · CPC title