Plastic molding compound and use thereof

Patent metadata

Field	Value
Publication number	US-2016295705-A1
Application number	US-201415037418-A
Country	US
Kind code	A1
Filing date	Dec 16, 2014
Priority date	Dec 20, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

A method for producing a laser-structurable component, wherein an extruded single- or multilayer molded part with at least one laser-structurable layer that forms an exposed surface of the molded part is applied onto the surface of a non-laser-structurable support element. Alternatively, the at least one laser-structurable layer may be back-molded with a non-laser-structurable thermoplastic support element so that at least one laser-structurable layer of the molded part forms at least one part of the surface of the laser-structurable component. The extruded single- or multilayer molded part is deep-drawn into the component. In the process, the laser-structurable layer of the molded part consists of a thermoplastic molding compound consisting of: (A) 30-99.9 wt. % of a thermoplastic consisting of polyamide; (B) 0.1-10 wt. % of an LDS additive; and (C) 0-60 wt. % of an additive material which is different from (A) and (B).

First claim

1 . A process for producing a laser-structurable component,
wherein an extruded, single-layer or multilayer molding having at least one laser-structurable layer that forms an exposed surface of the molding is applied to the surface of a non-laser-structurable carrier element, or is in-mold-coated with a non-laser-structurable thermoplastic carrier element, so that at least one laser-structurable layer of the molding forms at least one part of the surface of the laser-structurable component, or that the extruded, single-layer or multilayer molding is thermoformed to form the component, without having already formed conductor tracks, the laser-structurable layer of the molding consisting substantially over its entire area of a thermoplastic molding composition composed of: (A) 30-99.9 wt % of thermoplastic consisting of polyamide (A1) or of a mixture of a polyamide (A1) and another thermoplastic (A2), the fraction of polyamide (A1) being at least 70 wt %, based on the sum of (A1) and (A2); (B) 0.1-10 wt % of LDS additive; (C) 0-60 wt % of adjuvants different from (A) and (B); the sum of (A)-(C) making 100 wt %.

2 . The process as claimed in claim 1 , wherein the at least one laser-structurable layer of the molding is designed without having already formed conductor tracks, or the extruded, single-layer or multilayer molding is thermoformed to form the component without having already formed conductor tracks.

3 . The process as claimed in claim 1 , wherein the molding is a profile, a pipe, a film or a foil.

4 . The process as claimed in claim 1 , wherein the molding is adhered, laminated or lined onto the surface of the carrier element.

5 . The process as claimed in claim 1 , wherein the molding is extruded directly from the molten state onto the carrier element, in the form of a coherent film on the surface of the carrier element.

6 . The process as claimed in claim 1 , wherein the molding is introduced as a foil in a mold and is in-mold-coated by the carrier element.

7 . The process as claimed in claim 1 , wherein the carrier element and/or, the molding consist of a polyamide-containing plastic.

8 . The process as claimed in claim 1 , wherein (A1) is a cycloaliphatic amorphous polyamide (A1_4) or a mixture of aliphatic polyamides (A1_1) and semiaromatic, semicrystalline polyamides (A1_2), amorphous semiaromatic polyamides (A1_3) and/or amorphous cycloaliphatic polyamides (A1_4).

9 . The process as claimed in claim 1 , wherein the polyamide (A1) is constructed from one of the systems selected from the following group: aliphatic polyamide (A1_1), semiaromatic, semicrystalline polyamide (A1_2), semiaromatic amorphous polyamide (A1_3), cycloaliphatic amorphous polyamide (A1_4), or a mixture of such systems, the polyamide (A1_4) being constructed from
a) 60 to 100 mol %, of at least one aliphatic and/or aromatic dicarboxylic acid having 6 to 14 carbon atoms, and also 0 to 40 mol %, of at least one cycloaliphatic dicarboxylic acid having 8 to 20 carbon atoms, based on the total amount of the dicarboxylic acids; b) 50 to 100 mol %, of at least one cycloaliphatic diamine, including PACM, MACM, EACM, TMDC, BAC and IPD, and also 0 to 50 mol %, of at least one aliphatic diamine, having 4-18 carbon atoms, based on the total amount of diamines, and also optionally; c) aminocarboxylic acids and/or lactams each having 6 to 12 carbon atoms.

10 . The process as claimed in claim 1 , wherein the polyamide (A1) consists of
20-100 wt %, of amorphous cycloaliphatic polyamide (A1_4) and of 0-80 wt %, of aliphatic polyamide (A1_1) and/or semicrystalline, semiaromatic polyamide (A1_2).

11 . The process as claimed in claim 1 , wherein conductor tracks are formed on the component in one of the following operating steps on the component, by laser direct structuring and subsequent electroless deposition, and also, optionally, electrical and/or electronic components are subsequently incorporated.

12 . A component produced or producible by a process as claimed in claim 1 , having electrical conductor tracks.

13 . An extruded single-layer or multilayer molding, having at least one laser-structurable layer which forms an exposed surface of the molding, consisting substantially over its entire area of a thermoplastic molding composition composed of:
(A) 30-99.9 wt % of thermoplastic consisting of polyamide (A1) or of a mixture of a polyamide (A1) and another thermoplastic (A2), the fraction of polyamide (A1) being at least 70 wt %, based on the sum of (A1) and (A2); (B) 0.1-10 wt % of LDS additive; (C) 0-60 wt % of adjuvants different from (A) and (B); the sum of (A)-(C) making 100 wt %.

14 . The molding as claimed in claim 13 , wherein it is a profile, a pipe, a film or a foil, the molding being formed without already having formed conductor tracks or having already formed conductor tracks or precursor structures thereof.

15 . The molding as claimed in claim 13 , wherein the thermoplastic of component (A) is a polyamide or a polyamide mixture with at least one polyamide.

16 . The molding as claimed in claim 13 , wherein the thermoplastic of component (A) consists of a mixture of a polyamide (A1) and another thermoplastic (A2), where the fraction of polyamide (A1) is at least 80 wt %, or 100% based on the sum of (A1) and (A2),
and where further the polyamide (A1) is constructed from one of the systems selected from the following group: aliphatic polyamide (A1_1), semiaromatic, semicrystalline polyamide (A1_2), semiaromatic amorphous polyamide (A1_3), cycloaliphatic amorphous polyamide (A1_4), or a mixture of such systems, and the amount of component (A1_1), based on the sum of the components (A1_1), (A1_2), (A1_3) and (A1_4), is in the range from 40 to 95 wt %, and/or component (A1_1) is selected from the group consisting of the following: polyamide PA610, PA106, PA1010, PA1012, PA1212, PA11, PA12, or mixtures or copolyamides thereof; and/or component (A1_2) is selected from the group consisting of the following: PA 4T/4I, PA 4T/6I, PA 5T/5I, PA 6T/6, PA 6T/6I, PA 6T/6I/6, PA 6T/66, 6T/610, 6T/612, PA 6T/10T, PA 6T/10I, PA 9T, PA 10T, PA 12T, PA 10T/10I, PA10T/106, PA10T/12, PA10T/11, PA 6T/9T, PA 6T/12T, PA 6T/10T/6I, PA 6T/6I/6, PA 6T/6I/12, and also mixtures or copolyamides thereof; and/or component (A1_3) is selected from the group consisting of the following: 6I/6T, 10I/10T, 12/6T, MXD6/MXDI and also mixtures thereof; and/or component (A1_4) is selected from the group consisting of the following: polyamide PA MACM12, PA MACMI/12, PA MACMT/MACMI/12, MACM9, MACM10, MACM14, MACM16, MACM18, PACM12, PACM14, PACM16, PACM18, MACM12/PACM12, MACM14/PACM14, MACM16/PACM16, MACM18/PACM18, PACM9 18, 6I/6T/MACMI/MACMT/12, 6I/MACMI/MACMT, 6I/PACMI/PACMT, 6I/6T/MACMI, MACMI/MACM36, 12/PACMI or 12/MACMT, 6I/PACMT, 6/IPDT, BACI/BACT, MACM12/BAC12, 10I/10T/BACI/BACT, or mixtures or copolyamides thereof.

17 . The molding as claimed in claim 13 , wherein (A1) is a cycloaliphatic amorphous polyamide (A1_4) or a mixture of aliphatic polyamides (A1_1) and semiaromatic, semicrystalline polyamides (A1_2), amorphous semiaromatic polyamides (A1_3) and/or amorphous cycloaliphatic polyamides (A1_4);

18 . The molding as claimed in claim 13 , wherein the polyamide (A1) consists of
20-100 wt %, of amorphous cycloaliphatic polyamide (A1_4) and of 0-80 wt %, of aliphatic polyamide (A1_1) and/or semicrystalline, semiaromatic polyamide (A1_2).

19 . The molding as claimed in claim 13 , wherein (A1) is a cycloaliphatic amorphous polyamide (A1_4) or a mixture o

Assignees

• Ems Patent Ag

Inventors

• Stoeppelmann Georg

Classifications

• C08K2003/2248

  of copper · CPC title

• C08K7/14

  Glass · CPC title

• H05K3/185 Primary

  by making a catalytic pattern by photo-imaging · CPC title

• C08L77/04

  Polyamides derived from alpha-amino carboxylic acids (C08L77/10 takes precedence) · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title