Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices
US-2016374205-A1 · Dec 22, 2016 · US
Electroplating, e.g. finish plating
Electroplating, e.g. finish plating · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/0723 |
| Official title | Electroplating, e.g. finish plating |
| Display label | Electroplating, e.g. finish plating |
| Total patents | 620 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 35 |
| 2017 | 35 |
| 2018 | 48 |
| 2019 | 78 |
| 2020 | 68 |
| 2021 | 65 |
| 2022 | 66 |
| 2023 | 67 |
| 2024 | 77 |
| 2025 | 44 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Many-up wiring substrate, wiring board, and electronic device
US-9526167-B2 · Dec 20, 2016 · US
Self-repairing wiring and stretchable device
US-2016360612-A1 · Dec 8, 2016 · US
Printed circuit board and method for manufacturing same
US-2016353582-A1 · Dec 1, 2016 · US
Circuit substrate, semiconductor package and process for fabricating the same
US-9497864-B2 · Nov 15, 2016 · US
Metal substrate with insulated vias
US-2016286644-A1 · Sep 29, 2016 · US
Substrate via filling
US-9433101-B2 · Aug 30, 2016 · US
Wiring substrate
US-9431333-B2 · Aug 30, 2016 · US
Nitrogen containing polymers as levelers
US-2016237579-A1 · Aug 18, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-2016234935-A1 · Aug 11, 2016 · US
Maintainable substrate carrier for electroplating
US-RE46088-E · Aug 2, 2016 · US
Substrate via filling
US-2016219715-A1 · Jul 28, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-2016212857-A1 · Jul 21, 2016 · US
Electric conductive heat dissipation substrate
US-9397279-B2 · Jul 19, 2016 · US
Conductive pattern, electric circuit, electromagnetic wave shield, and method for producing conductive pattern
US-2016198594-A1 · Jul 7, 2016 · US
Metal-film forming apparatus and metal-film forming method
US-2016186354-A1 · Jun 30, 2016 · US
Amino sulfonic acid based polymers for copper electroplating
US-2016186347-A1 · Jun 30, 2016 · US
Microelectronic substrates having copper alloy conductive route structures
US-2016183361-A1 · Jun 23, 2016 · US
Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer
US-9365693-B2 · Jun 14, 2016 · US
Method of manufacturing a multilayer substrate structure for fine line
US-9370110-B2 · Jun 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/0723?
- CPC H05K2203/0723 is the Cooperative Patent Classification code for “Electroplating, e.g. finish plating.”
- How many patents are filed under CPC H05K2203/0723 (Electroplating, e.g. finish plating)?
- Our database includes 620 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/0723 growing?
- Publication counts under this code: 77 in 2024 vs 44 in 2025 (latest complete years).