Conductive pattern, electric circuit, electromagnetic wave shield, and method for producing conductive pattern

US2016198594A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016198594-A1
Application numberUS-201615067031-A
CountryUS
Kind codeA1
Filing dateMar 10, 2016
Priority dateMar 28, 2012
Publication dateJul 7, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

First claim

Opening claim text (preview).

1 . A conductive pattern comprising: a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, wherein a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B); and a plating layer (D) stacked on a surface of the conductive layer (A). 2 . The conductive pattern according to claim 1 , wherein the compound (a1) having the basic nitrogen atom-containing group is a polyalkyleneimine, or a polyalkyleneimine having a polyoxyalkylene structure containing an oxyethylene unit. 3 . The conductive pattern according to claim 1 , wherein the functional group [X] is at least one selected from the group consisting of a keto group, an epoxy group, an acid group, an N-alkylol group, and an isocyanate group. 4 . The conductive pattern according to claim 1 , wherein the compound (b1) having the functional group [X] contains at least one selected from the group consisting of a urethane resin (x1) having the functional group [X], a vinyl resin (x2) having the functional group [X], and a urethane-vinyl composite resin (x3) having the functional group [X]. 5 . The conductive pattern according to claim 1 produced by: applying a composition (b1-1) containing the compound (b1) having the functional group [X] onto a part of a surface or an entire surface of a substrate to form a coating film (b); applying a fluid (A1) containing the compound (a1) having the basic nitrogen atom-containing group and the conductive substance (a2) onto a part of a surface or an entire surface of the coating film (b); and conducting heating. 6 . An electric circuit comprising the conductive according to claim 1 . 7 . An electromagnetic wave shield comprising the conductive pattern according to claim 1 .

Assignees

Inventors

Classifications

  • Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

  • using a liquid · CPC title

  • Conductive organic materials, e.g. conductive adhesives or conductive inks · CPC title

  • by the use of a coupling agent, e.g. silane · CPC title

  • Multilayer circuits · CPC title

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What does patent US2016198594A1 cover?
An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing grou…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification H05K9/0086. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 07 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).