Maintainable substrate carrier for electroplating

Patent metadata

Field	Value
Publication number	US-RE46088-E
Application number	US-201514704647-A
Country	US
Kind code	E1
Filing date	May 5, 2015
Priority date	Sep 23, 2010
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

First claim

What is claimed is:

1. A substrate carrier for use in electroplating a plurality of substrates, the carrier comprising:
a non-conductive carrier body on which the substrates are placed;
conductive lines embedded within the carrier body;
a plurality of conductive clip attachment parts, the clip attachment parts being attached in a permanent manner to the conductive lines embedded within the carrier body; and
a plurality of contact clips attached in a removable manner to the clip attachment parts, the contact clips holding the substrates in place and conductively connecting the substrates with the conductive lines.

2. The substrate carrier of claim 1 , wherein a contact clip includes:
a base of the contact clip;
a hole in the base which is aligned with a clip attachment part of the substrate carrier;
an O-ring arranged between the base of the contact clip and the carrier body; and
a connecting screw going through said hole in the base and through said O-ring so as to attach the base to the clip attachment part and compress the O-ring.

3. The substrate carrier of claim 1 , wherein the contact clip further includes:
a spring coupled to the plate;
an arm coupled to the spring; and
a tip coupled to the arm, wherein the tip makes contact with the substrate being held by the clip.

4. The substrate carrier of claim 3 , wherein the spring of the contact clip comprises multiple bends of metal.

5. The substrate carrier of claim 3 , wherein the arm of the contact clip comprises a tapered metal plate which is narrower towards the tip portion.

6. The substrate carrier of claim 3 , wherein a single piece of metal is used to form the base, the spring and the arm of the contact clip.

7. The substrate carrier of claim 6 , wherein the single piece of metal comprises a stainless steel.

8. The substrate carrier of claim 1 , wherein a contact clip comprises:
a base of the contact clip;
a hole in the base which is aligned with a clip attachment part of the substrate carrier;
a spring-attachment plate of the contact clip;
a hole in the plate which is aligned with the hole in the base; and
a connecting screw going through said holes and being screwed onto the clip attachment part so as to attach the base and the plate to the carrier body.

9. The substrate carrier of claim 8 , wherein the contact clip further comprises:
an O-ring which has a hole which is aligned between said holes of the base and the plate and which is compressed between the base and the plate.

10. The substrate carrier of claim 9 , wherein the contact clip further comprises:
a torsion spring mechanically coupled to the plate; and
a lever mechanically coupled to both the plate and the spring.

11. The substrate carrier of claim 10 , wherein the base and the lever are plastic parts, and wherein the screw, the plate, and the spring are metal parts.

12. The substrate carrier of claim 10 , wherein pressing down on a handle of the lever causes an arm of the spring to lift away from a surface of the carrier body.

13. The substrate carrier of claim 1 , further comprising:
a plurality of spacers on the carrier body, the spacers being configured to space the substrates from a surface of the carrier body when the substrates are clipped onto the carrier.

14. The substrate carrier of claim 1 , further comprising:
a plurality of aligning features on the carrier body, wherein the aligning features are arranged to align the substrates clipped onto the carrier into substrate holding areas and to protect the contact clips from the substrates.

15. The substrate carrier of claim 14 , wherein the aligning features comprise removable pegs.

16. The substrate carrier of claim 1 , further comprising:
an electrically conductive bus bar configured at a top side of the carrier body and conductively coupled to the conductive lines embedded in the carrier body, the electrically-conductive bus bar including a plurality of mounting holes for mounting the carrier onto a work arm for dipping the carrier body into, and raising the carrier body out of, an electroplating bath while a voltage is applied to the bus bar.

17. A method of electroplating substrates, the method comprising:
clipping the substrates to a substrate carrier, the substrate carrier comprising a non-conductive carrier body on which the substrates are placed, conductive lines embedded within the carrier body, conductive clip attachment parts attached in a permanent manner to the conductive lines, and contact clips attached in a removable manner to the clip attachment parts;
mounting the substrate carrier onto a mechanical arm;
applying a voltage to the substrates via the contact clips; and
dipping the substrate carrier with the substrates clipped thereon into an electroplating bath; and
unclipping the substrates from the substrate carrier when the electroplating is complete.

18. The method of claim 17 , wherein an automated apparatus is utilized to open the clips when the substrates are clipped to, or unclipped from, the substrate carrier.

19. The method of claim 17 , further comprising:
periodically replacing clips that are removably attached to the carrier body.

20. The method of claim 17 , further comprising:
periodically replacing spacers and aligning features that are removably attached to the carrier body.

Assignees

• Sunpower Corp

Inventors

• Chen Chen-An
• Abas Emmanuel Chua
• Divino Edmundo Anida
• Ermita Jake Randal G
• Capulong Jose Francisco S
• Castillo Arnold Villamor
• Ma Diana Xiaobing

Classifications

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• H05K2203/0169

  Using a temporary frame during processing · CPC title

• H05K3/0097

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D17/08

  Supporting} racks {, i.e. not for suspending · CPC title