Electric conductive heat dissipation substrate

Patent metadata

Field	Value
Publication number	US-9397279-B2
Application number	US-201414287205-A
Country	US
Kind code	B2
Filing date	May 27, 2014
Priority date	Dec 27, 2013
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

First claim

What is claimed is:

1. An electric conductive heat dissipation substrate, comprising:
a ceramic substrate;
a seed layer, on the ceramic substrate, wherein the seed layer is one selected from the group consisting of nickel-phosphorous alloy, nickel-boron alloy, nickel-tungsten-phosphorous alloy, nickel-molybdenum-phosphorous alloy, nickel-tungsten-boron alloy, nickel-molybdenum-boron alloy, cobalt-phosphorous alloy, cobalt-boron alloy, cobalt-tungsten-phosphorous alloy, cobalt-molybdenum-phosphorous alloy, cobalt-tungsten-boron alloy and cobalt-molybdenum-boron alloy, or a mixture thereof;
a buffering material layer, formed on the seed layer; and
a copper circuit layer, on the buffering material layer, wherein
a thermal expansion coefficient of the buffering material layer is between those of the ceramic substrate and the copper circuit layer, and
the buffering material layer is composed of a metal material and a ceramic material, or is composed of an alloy material and the ceramic material.

2. The electric conductive heat dissipation substrate according to claim 1 , wherein the metal material is one selected from the group consisting of copper, nickel, cobalt, silver and gold.

3. The electric conductive heat dissipation substrate according to claim 1 , wherein the alloy material is one selected from the group consisting of copper-tungsten, copper-manganese, nickel-tungsten, cobalt-tungsten, copper-molybdenum, nickel-molybdenum, cobalt-molybdenum, nickel-tungsten-phosphorous, nickel-tungsten-boron, cobalt-tungsten-phosphorous, cobalt-tungsten-boron, and cobalt-molybdenum-boron.

4. The electric conductive heat dissipation substrate according to claim 1 , wherein the ceramic material is one selected from the group consisting of silicon carbide, aluminum oxide, zirconium oxide, cerium oxide, tungsten carbide, titanium oxide and silicon dioxide, or a mixture thereof.

5. The electric conductive heat dissipation substrate according to claim 1 , wherein the buffering material layer comprises:
40 wt. % to 95 wt. % of the metal material or the alloy material; and
5 wt. % to 60 wt. % of the ceramic material.

6. The electric conductive heat dissipation substrate according to claim 1 , wherein a particle size of the ceramic material in the buffering material layer is less than 10 μm.

7. The electric conductive heat dissipation substrate according to claim 1 , wherein a thickness of the buffering material layer is 1 time or more of a thickness of the copper circuit layer.

8. The electric conductive heat dissipation substrate according to claim 1 , wherein a thickness of the copper circuit layer is less than 50 μm.

9. The electric conductive heat dissipation substrate according to claim 1 , wherein a material of the ceramic substrate comprises aluminum oxide, aluminum nitride or silicon carbide.

10. The electric conductive heat dissipation substrate according to claim 1 , wherein a thickness of the seed layer is less than 5 μm.

11. The electric conductive heat dissipation substrate according to claim 1 , wherein a total thickness of the seed layer, the buffering material layer and the copper circuit layer is less than 100 μm.

Assignees

• Ind Tech Res Inst

Inventors

• Wang Cheng-Chuan
• Wong Cheng-Chou
• Yen Chia-Ying
• Chen Hsin-Hwa

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title

• H05K2203/0709

  Catalytic ink or adhesive for electroless plating · CPC title