Many-up wiring substrate, wiring board, and electronic device

Patent metadata

Field	Value
Publication number	US-9526167-B2
Application number	US-201113882676-A
Country	US
Kind code	B2
Filing date	Mar 30, 2011
Priority date	Nov 2, 2010
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A many-up wiring substrate includes an insulating base substrate in which a plurality of wiring board regions are arranged in at least one of a vertical direction and a horizontal direction; a hole disposed in one main surface of the insulating base substrate, and straddling adjacent wiring board regions of the plurality of wiring board regions or straddling the wiring board regions and a dummy region; a conductor disposed on an inner surface of the hole; and a through hole disposed so as to extend from the inner surface of the hole of the wiring board regions to the other main surface of the insulating base substrate.

First claim

The invention claimed is:

1. A wiring board, comprising:
an insulating substrate including one main surface and an other main surface;
a notch disposed on a side surface of the insulating substrate so as to extend from the one main surface of the insulating substrate to halfway in a thickness direction of the insulating substrate, the notch including an inner surface;
a conductor disposed on the inner surface of the notch;
a recess part disposed in the other main surface of the insulating substrate overlapping the notch in a plan view, the recess part including an inner surface; and
a through hole disposed so as to extend from the inner surface of the notch to the inner surface of the recess part.

2. The wiring board according to claim 1 , wherein an opening of the through hole is disposed in the inner surface of the notch so as to be close to a center of the insulating substrate.

3. The wiring board according to claim 1 , wherein the through hole has a linear form in the thickness direction of the insulating substrate.

4. The wiring board according to claim 1 , wherein an opening of the through hole is disposed in the inner surface of the notch so as to be along a corner disposed between a side surface and a bottom surface of the inner surface of the notch.

5. An electronic device, comprising:
the wiring board according to claim 1 ;
an electronic component element mounted on the wiring board; and
a lid disposed on the wiring board so as to cover the electronic component element.

6. The electronic device according to claim 5 , wherein a bonding member, which bonds the wiring board and the lid, is disposed from a position between the wiring board and the lid to the through hole.

Assignees

• Segawa Hiroyuki
• Kyocera Corp

Inventors

• Segawa Hiroyuki

Classifications

• H10W76/157 Primary

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H01L23/13

  Electricity · mapped topic

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title