Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer

Patent metadata

Field	Value
Publication number	US-9365693-B2
Application number	US-201314129183-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 23, 2012
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

First claim

The invention claimed is:

1. A thermoplastic resin composition comprising:
per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above;
(B) 10 to 80 parts by weight of a glass filler;
(C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and
(D) 20 to 150 parts by weight of titanium oxide,
wherein the crystalline thermoplastic resin is a polyamide resin, the polyamide resin contains a diamine structural unit and a dicarboxylic acid structural unit, and 50 mol % or more of the diamine structural unit is derived from xylylene diamine.

2. The thermoplastic resin composition of claim 1 ,
wherein the (C) laser direct structuring additive contains antimony and tin, with a content of tin larger than that of antimony.

3. The thermoplastic resin composition of claim 1 ,
wherein the (C) laser direct structuring additive contains antimony and tin oxide, with a content of tin larger than that of antimony.

4. The thermoplastic resin composition of claim 1 ,
wherein the (C) laser direct structuring additive has a core composed of a composition having a reflectance at 450 nm of 50% or above, and has a coating composed of a composition containing antimony and tin, with a content of tin larger than that of antimony, formed on a part of, or over the entire surface of the core.

5. The thermoplastic resin composition of claim 4 ,
wherein the composition composing the core contains a metal oxide.

6. The thermoplastic resin composition of claim 1 ,
further comprising 1 to 20 parts by weight of talc per 100 parts by weight of the thermoplastic resin composition.

7. The thermoplastic resin composition of claim 1 ,
wherein the (D) titanium oxide has an average primary particle size of 1 μm or smaller.

8. The thermoplastic resin composition of claim 1 ,
wherein the (D) titanium oxide has the rutile structure.

9. The thermoplastic resin composition of claim 1 ,
wherein the (B) glass filler is at least one material selected from chopped fiber, milled fiber, flake, bead and balloon.

10. The thermoplastic resin composition of claim 1 ,
wherein the (B) glass filler is E-glass.

11. The thermoplastic resin composition of claim 1 , further comprising 0.01 to 5 parts by weight of an organic or/and inorganic heat stabilizer per 100 parts by weight of the thermoplastic resin composition.

12. The thermoplastic resin composition of claim 11 , wherein the organic or/and inorganic heat stabilizer is substantially free from copper element.

13. The thermoplastic resin composition of claim 1 , further comprising 0.01 to 5 parts by weight of an organic or/and inorganic light stabilizer per 100 parts by weight of the thermoplastic resin composition.

14. The thermoplastic resin composition of claim 1 ,
wherein the (A) crystalline thermoplastic resin contains in a molecule thereof an aromatic ring, with a ratio of carbon atoms composing the aromatic ring relative to the polyamide resin molecule of 30 mol % or more.

15. A resin article obtained by molding the thermoplastic composition described in claim 1 .

16. The resin article of claim 15 , further comprising a plated layer formed on the surface of the resin article.

17. A light emitting diode comprising the resin article claim 15 .

18. The light emitting diode of claim 17 , wherein the resin article functions as a reflective plate.

19. The resin article of claim 16 ,
wherein the plated layer performs as an electro-conductive circuit.

20. A method of manufacturing a resin article with a plated layer, comprising irradiating the surface of the resin article, obtained by molding the thermoplastic resin composition described in claim 1 , with a laser, and then applying a metal to form the plated layer.

21. The method of manufacturing a resin article with a plated layer of claim 20 , wherein the plated layer contains at least one kind selected from, copper, nickel, silver and gold.

22. The method of manufacturing a resin article with a plated layer of claim 21 , wherein the plated layer is used in the form of multi-layered structure.

23. A method of manufacturing a part for a light emitting diode device having an electro-conductive circuit, comprising the method of manufacturing a resin article with a plated layer described in claim 20 .

24. A thermoplastic resin composition comprising:
per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above;
(B) 10 to 80 parts by weight of a glass filler;
(C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and
(D) 20 to 150 parts by weight of titanium oxide,
wherein the (C) laser direct structuring additive contains antimony and tin.

Assignees

• Mitsubishi Eng Plastics Corp

Inventors

• Takano Takahiro
• Sumino Takahiko
• ISHIHARA Kentarou

Classifications

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K2003/2241

  Titanium dioxide · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title