Rapid pcb prototyping by selective adhesion
US-2017374741-A1 · Dec 28, 2017 · US
Temporary metallic carrier, e.g. for transferring material
Temporary metallic carrier, e.g. for transferring material · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/0152 |
| Official title | Temporary metallic carrier, e.g. for transferring material |
| Display label | Temporary metallic carrier, e.g. for transferring material |
| Total patents | 167 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 22 |
| 2017 | 19 |
| 2018 | 19 |
| 2019 | 11 |
| 2020 | 17 |
| 2021 | 10 |
| 2022 | 11 |
| 2023 | 8 |
| 2024 | 12 |
| 2025 | 9 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing combined wiring board
US-9844151-B2 · Dec 12, 2017 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-9839124-B2 · Dec 5, 2017 · US
Wiring substrate and method for manufacturing the same
US-2017256478-A1 · Sep 7, 2017 · US
Substrate structure
US-2017207156-A1 · Jul 20, 2017 · US
Electronic textile and method of manufacturing an electronic textile
US-9706648-B2 · Jul 11, 2017 · US
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
US-2017188455-A1 · Jun 29, 2017 · US
Pad-less interconnect for electrical coreless substrate
US-9691727-B2 · Jun 27, 2017 · US
Method of fabricating substrate structure
US-2017171981-A1 · Jun 15, 2017 · US
Circuit board incorporating semiconductor IC and manufacturing method thereof
US-9635756-B2 · Apr 25, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
US-2017032978-A1 · Feb 2, 2017 · US
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381805-A1 · Dec 29, 2016 · US
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381806-A1 · Dec 29, 2016 · US
Embedded architecture using resin coated copper
US-9451696-B2 · Sep 20, 2016 · US
Wiring substrate and semiconductor package
US-9433109-B2 · Aug 30, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-2016234935-A1 · Aug 11, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-2016212857-A1 · Jul 21, 2016 · US
Substrate structure and manufacturing method thereof
US-2016174390-A1 · Jun 16, 2016 · US
Bumpless build-up layer package including a release layer
US-2016141265-A1 · May 19, 2016 · US
Manufacturing method of interposed substrate
US-2016133483-A1 · May 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/0152?
- CPC H05K2203/0152 is the Cooperative Patent Classification code for “Temporary metallic carrier, e.g. for transferring material.”
- How many patents are filed under CPC H05K2203/0152 (Temporary metallic carrier, e.g. for transferring material)?
- Our database includes 167 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/0152 growing?
- Publication counts under this code: 12 in 2024 vs 9 in 2025 (latest complete years).