Method for manufacturing combined wiring board

Patent metadata

Field	Value
Publication number	US-9844151-B2
Application number	US-201414492424-A
Country	US
Kind code	B2
Filing date	Sep 22, 2014
Priority date	Sep 20, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

First claim

What is claimed is:

1. A method for manufacturing a combined wiring board, comprising:
preparing a plurality of wiring boards;
preparing a metal frame having a plurality of opening portions configured to accommodate the plurality of wiring boards, respectively;
positioning the wiring boards in the opening portions of the metal frame, respectively; and
forming a plurality of crimped portions in the metal frame by plastic deformation such that the sidewalls of the wiring boards bond to sidewalls of the opening portions in the metal frame,
wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that when the wiring boards are positioned in the opening portions of the metal frame, the sidewalls of the wiring boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the metal frame, the forming of the crimped portions includes generating the plastic deformation such that the sidewalls of the opening portions in the metal frame abut the narrow-space portions of the sidewalls of the wiring boards before the wide-space portions of the sidewalls of the wiring boards, each of the wiring boards has a main body portion, a plurality of extension portions formed on short sides of the main body portion and extending in a longitudinal direction of the main body portion, respectively, and a plurality of protruding portions protruding from the extension portions perpendicular to the longitudinal direction of the main body portion, the extension portions have widths which are shorter than the short sides of the main body portion, and each of the opening portions in the metal frame has a plurality of U-shaped portions configured to accommodate the protruding portions of each of the wiring boards, respectively, such that the sidewalls of the wiring boards bond to the sidewalls in the U-shaped portions of the opening portions in the metal frame.

2. A method for manufacturing a combined wiring board according to claim 1 , wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that the sidewalls of the wiring boards have arc-shaped portions which are recessed toward the wiring boards.

3. A method for manufacturing a combined wiring board according to claim 2 , wherein the forming of the crimped portions includes forming the crimped portions such that the sidewalls of the opening portions of the metal frame abut the arc-shaped portions of the sidewalls of the wiring boards and that linear portions of the sidewalls of the metal frame abut linear portions of the sidewalls of the wiring boards adjacent to the arc-shaped portions.

4. A method for manufacturing a combined wiring board according to claim 2 , wherein the wide-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces, and the narrow-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces.

5. A method for manufacturing a combined wiring board according to claim 4 , wherein the forming of the crimped portions includes forming the crimped portions such that the sidewalls of the opening portions of the metal frame abut the arc-shaped portions of the sidewalls of the wiring boards and that linear portions of the sidewalls of the metal frame abut linear portions of the sidewalls of the wiring boards adjacent to the arc-shaped portions.

6. A method for manufacturing a combined wiring board according to claim 1 , wherein the wide-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces, and the narrow-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces.

7. A method for manufacturing a combined wiring board according to claim 1 , wherein the forming of the crimped portions includes forming the crimped portions such that two crimped portions are positioned to sandwich a corner portion of each of the wiring boards.

8. A method for manufacturing a combined wiring board according to claim 1 , wherein the forming of the crimped portions comprises forming the crimped portions in the metal frame such that the sidewalls of the wiring boards simultaneously bond to the sidewalls of the opening portions in the metal frame.

9. A method for manufacturing a combined wiring board, comprising:
preparing a plurality of wiring boards;
preparing a metal frame having a plurality of opening portions configured to accommodate the plurality of wiring boards, respectively;
positioning the wiring boards in the opening portions of the metal frame, respectively; and
forming a plurality of crimped portions in the metal frame by plastic deformation such that the sidewalls of the wiring boards bond to sidewalls of the opening portions in the metal frame,
wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that when the wiring boards are positioned in the opening portions of the metal frame, the sidewalls of the wiring boards form wide-space portions and narrow-space portions with respect to the side walls of the opening portions in the metal frame, the forming of the crimped portions includes generating the plastic deformation such that the sidewalls of the opening portions in the metal frame abut the narrow-space portions of the sidewalls of the wiring boards before the wide-space portions of the sidewalls of the wiring boards, the wide-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces, the narrow-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces, each of the wiring boards has a main body portion, a plurality of extension portions formed on short sides of the main body portion and extending in a longitudinal direction of the main body portion, respectively, and a plurality of protruding portions protruding from the extension portions perpendicular to the longitudinal direction of the main body portion, the extension portions have widths which are shorter than the short sides of the main body portion, and each of the opening portions in the metal frame has a plurality of U-shaped portions configured to accommodate the protruding portions of each of the wiring boards, respectively, such that end sides of the extension portions form the wide-space portions of the sidewalls of the wiring boards and that the U-shaped portions form the narrow-space portions of the sidewalls of the wiring boards.

10. A method for manufacturing a combined wiring board according to Claim 9 , wherein the forming of the crimped portions comprises forming the crimped portions in the metal frame such that the sidewalls of the wiring boards simultaneously bond to the sidewalls of the opening portions in the metal frame.

11. A method for manufacturing a combined wiring board according to claim 9 , wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that the sidewalls of the wiring boards have arc-shaped portions which are recessed toward the wiring boards.

12. A method for manufacturing a combined wiring board according to claim 11 , wherein the forming of the crimped portions includes forming the crimped portions such that the sidewalls of the opening portions of the metal frame abut the arc-shaped portions of the sidewalls of the wiring boards and that linear portions of the sidewalls of the metal frame abut linear portions of the sidewalls of the wiring boards adjacent to the arc-shaped portions.

13. A method for manufacturing a combined wiring board according to claim 11 , wherein the wide-space portions of the sidewalls of the wiring boards have arc-shaped curved surfaces, an

Assignees

• Ibiden Co Ltd

Inventors

• Ishihara Teruyuki
• Takahashi Michimasa

Classifications

• H05K2201/10598

  Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB · CPC title

• H05K2203/1484

  Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components · CPC title

• H05K2201/2018

  Presence of a frame in a printed circuit or printed circuit assembly · CPC title

• H05K3/368 Primary

  parallel to each other (H05K3/361 takes precedence) · CPC title

• Y10T29/49126

  Assembling bases · CPC title