Slot-shielded coplanar strip-line compatible with CMOS processes
US-9831173-B2 · Nov 28, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/64 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 241 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 26 |
| 2016 | 19 |
| 2017 | 29 |
| 2018 | 25 |
| 2019 | 33 |
| 2020 | 31 |
| 2021 | 23 |
| 2022 | 16 |
| 2023 | 16 |
| 2024 | 11 |
| 2025 | 8 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Transformer comprising a rounded coil
US-9780161-B2 · Oct 3, 2017 · US
Semiconductor module
US-9772359-B2 · Sep 26, 2017 · US
Packaging structure and packaging method thereof
US-2017271306-A1 · Sep 21, 2017 · US
Electronic device and methods to customize electronic device electromagnetic emissions
US-2017245361-A1 · Aug 24, 2017 · US
Three-d power converter in three distinct strata
US-2017237344-A1 · Aug 17, 2017 · US
Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
US-9711479-B2 · Jul 18, 2017 · US
Manufacturing method of chip package and package substrate
US-2017186709-A1 · Jun 29, 2017 · US
Integrated semiconductor device and wafer level method of fabricating the same
US-9691725-B2 · Jun 27, 2017 · US
Wiring substrate and manufacturing method thereof
US-9666542-B2 · May 30, 2017 · US
Electronic module
US-9655265-B2 · May 16, 2017 · US
Embedded semiconductive chips in reconstituted wafers, and systems containing same
US-9646851-B2 · May 9, 2017 · US
Packaging mechanisms for dies with different sizes of connectors
US-9646894-B2 · May 9, 2017 · US
Energized ophthalmic lens
US-9615917-B2 · Apr 11, 2017 · US
Semiconductor device with discrete blocks
US-9543278-B2 · Jan 10, 2017 · US
Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
US-9530773-B2 · Dec 27, 2016 · US
Low-profile chip package with modified heat spreader
US-9530714-B2 · Dec 27, 2016 · US
A substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
US-2016372440-A1 · Dec 22, 2016 · US
Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
US-9515031-B2 · Dec 6, 2016 · US
Printed circuit board and printed circuit board for camera module
US-9496594-B2 · Nov 15, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/64?
- CPC H01L23/64 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/64 (Electricity)?
- Our database includes 241 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/64 growing?
- Publication counts under this code: 11 in 2024 vs 8 in 2025 (latest complete years).