Printed circuit board and printed circuit board for camera module

Patent metadata

Field	Value
Publication number	US-9496594-B2
Application number	US-201414464362-A
Country	US
Kind code	B2
Filing date	Aug 20, 2014
Priority date	May 23, 2014
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A printed circuit board includes a signal transmitting part and a ground part disposed having an insulating layer therebetween. The ground part includes an impedance adjusting part.

First claim

What is claimed is:

1. A printed circuit board comprising:
a signal transmitting part;
a ground part that includes an impedance adjusting part in the same layer as the ground part; and
an insulating layer between the signal transmitting part and the ground part,
wherein the signal transmitting part includes at least one signal line,
wherein the impedance adjusting part includes a conductor pattern, and
wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each corresponding region in corresponding regions of the signal transmitting part and the ground part is minimized.

2. The printed circuit board according to claim 1 , wherein the
conductor pattern has a path longer than the signal line.

3. The printed circuit board according to claim 1 , wherein the conductor pattern includes a plurality of unit patterns having an open curve shape.

4. The printed circuit board according to claim 1 , wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each region in the ground part is minimized.

5. The printed circuit board according to claim 3 , wherein the unit pattern having the open curve shape includes at least one sub-unit pattern.

6. The printed circuit board according to claim 5 , wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each region in the ground part is minimized.

7. The printed circuit board according to claim 5 , wherein the sub-unit pattern has the open curve shape.

8. The printed circuit board according to claim 7 , wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each region in the ground part is minimized.

9. The printed circuit board according to claim 5 , wherein the sub-unit pattern has a closed curve shape.

10. The printed circuit board according to claim 9 , wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each region in the ground part is minimized.

11. The printed circuit board according to claim 3 , wherein at least one unit pattern having a closed curve shape is included between the unit patterns having the open curve shape.

12. The printed circuit board according to claim 11 , wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each region in the ground part is minimized.

13. The printed circuit board according to claim 3 , wherein the conductor pattern forms one path by connecting the plurality of unit patterns to one other.

14. The printed circuit board according to claim 13 , wherein when the conductor pattern including the plurality of unit patterns having the open curve shape and the conductor pattern including a plurality of unit patterns having a closed curve shape have the same ratio as the conductor pattern in the ground part, impedance formed by the conductor pattern including the plurality of unit patterns having the open curve shape is larger than impedance formed by the conductor pattern including the plurality of unit patterns having the closed curve shape.

15. A printed circuit board for a camera module, comprising:
a signal transmitting part configured to transmit a control signal;
a ground part providing a ground to the signal transmitting part; and
an impedance adjusting part formed as part of the ground part,
wherein the signal transmitting part includes at least one signal line,
wherein the first impedance adjusting part includes a conductor pattern, and
wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each corresponding region in corresponding regions of the signal transmitting part and the ground part is minimized.

16. The printed circuit board for the camera module according to claim 15 , wherein the
conductor pattern has a path longer than the signal line.

17. The printed circuit board for the camera module according to claim 15 , wherein the conductor pattern includes a plurality of unit patterns having an open curve shape.

18. The printed circuit board for the camera module according to claim 15 , wherein the conductor pattern is formed so that a ratio deviation of the conductor pattern for each region in the ground part is minimized.

19. The printed circuit board for the camera module according to claim 17 , where the conductor pattern forms one path by connecting the plurality of unit patterns to one other.

20. The printed circuit board for the camera module according to claim 19 , wherein when the conductor pattern including the plurality of unit patterns having the open curve shape and the conductor pattern including a plurality of unit patterns having a closed curve shape have the same ratio as the conductor pattern in the ground part, impedance formed by the conductor pattern including the plurality of unit patterns having the open curve shape is larger than impedance formed by the conductor pattern including the plurality of unit patterns having the closed curve shape.

21. A printed circuit board comprising:
a signal line;
a conductive ground part that is discontinuous along a line parallel to the signal line; and
an insulating layer between the signal line and the ground part
wherein the ground part is a layer comprised of rows of conductive patterns that extend from a position on one side of the signal line to a position on another side of the signal line, and
wherein the rows are connected to each other to form a conductive path.

22. The printed circuit board according to claim 21 , wherein the rows of conductive patterns are separated from each other by a gap.

23. The printed circuit board according to claim 21 ,
wherein the signal line is between the ground part and a second conductive ground part that is discontinuous along a line parallel to the signal line, and
the second conductive ground part is separated from the signal line by a second insulating layer.

24. The printed circuit board according to claim 1 , wherein the conductor pattern forms one path by connecting the plurality of unit patterns to one other.

25. The printed circuit board according to claim 4 , wherein the conductor pattern forms one path by connecting the plurality of unit patterns to one other.

26. The printed circuit board according to claim 24 , wherein when the conductor pattern including the plurality of unit patterns having the open curve shape and the conductor pattern including a plurality of unit patterns having a closed curve shape have the same ratio as the conductor pattern in the ground part, impedance formed by the conductor pattern including the plurality of unit patterns having the open curve shape is larger than impedance formed by the conductor pattern including the plurality of unit patterns having the closed curve shape.

27. The printed circuit board according to claim 25 , wherein when the conductor pattern including the plurality of unit patterns having the open curve shape and the conductor pattern including a plurality of unit patterns having a closed curve shape have the same ratio as the conductor pattern in the ground part, impedance formed by the conductor pattern including the plurality of unit patterns having the open curve shape is larger than impedance formed by the conductor pattern including the plurality of unit patterns having the closed curve shape.

28. The printed

Assignees

• Samsung Electro Mech

Inventors

• Park Dae Hyun
• Kim Han
• Choi Seong Hee
• Han Mi Ja

Classifications

• H05K1/0253 Primary

  Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence) · CPC title

• H05K2201/09263

  Meander · CPC title

• H03H7/38

  Impedance-matching networks · CPC title

• H05K1/0245

  Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

• H01P5/19 Primary

  of the junction type · CPC title