Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9711479-B2
Application number	US-201414902360-A
Country	US
Kind code	B2
Filing date	Jul 2, 2014
Priority date	Jul 3, 2013
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A die package having a plurality of connection pads, a plurality of wire leads having metal cores with a defined core diameter, and a dielectric layer surrounding the metal cores having a defined dielectric thickness, at least one first connection pad held in a mold compound covering the die and the plurality of leads connected to at least one metal core, and at least one second connection pad held in the mold compound covering the die and the plurality of leads connected to at least one metal core. Further, the present invention relates to a method for manufacturing a substrate less die package.

First claim

Thus, having described the invention, what is claimed is:

1. A die package comprising:
a die having a plurality of connection pads;
a plurality of leads having a metal core with a defined core diameter, two or more dielectric layers of different composition surrounding the metal core having defined dielectric thicknesses, and an outer metal layer deposited over the dielectric layers, respectively;
at least one first connection pad held in a mold compound covering the die and the plurality of leads connected to at least one metal core; and
at least one second connection pad held in the mold compound covering the die and the plurality of leads connected to at least one metal core;
wherein the first connection pad is connected to the metal core of a first lead with a first metal core diameter, and the second connection pad is connected to the metal core of a second lead with a second metal core diameter, the metal core diameters differing in diameter; and
wherein the first connection pad is connected to the metal core of a first lead with a first length, and the second connection pad is connected to the metal core of a second lead with a second length, the first length differing from the second length.

2. The die package of claim 1 , wherein the first length differs by 50% or more from the second length.

3. The die package of claim 1 , wherein the first lead and the second lead have substantially the same impedance or alternatively have distinctly different impedances.

4. The die package of claim 1 including at least one ground pad, wherein at least one of the outer metal layers is connected to the at least one ground pad.

5. The die package of claim 1 , wherein the impedance of a subset of the plurality the leads is within 10%.

6. The die package of claim 1 , wherein the package is a coreless package without a permanent substrate for die attachment.

7. A method of manufacture of a die package, said die package comprising:
a die having a plurality of connection pads;
a plurality of leads having a metal core with a defined core diameter, two or more dielectric layers of different composition surrounding the metal core having defined dielectric thicknesses, and an outer metal layer deposited over the dielectric layers, respectively;
at least one first connection pad held in a mold compound covering the die and the plurality of leads connected to at least one metal core; and
at least one second connection pad held in the mold compound covering the die and the plurality of leads connected to at least one metal core;

wherein the first connection pad is connected to the metal core of a first lead with a first metal core diameter, and the second connection pad is connected to the metal core of a second lead with a second metal core diameter, the metal core diameters differing in diameter; said method comprising the following steps:
placing of one or more dies on a temporary workpiece including temporarily attached pads;
using wirebonding to connect the die to the temporarily attached pads, a first pad being connected to the metal core of a first wire with a first metal core diameter, and a second pad being connected to the metal core of a second wire with a second metal core diameter, the metal cores differing in diameter;
coating of the metal cores of the wirebonds with two or more dielectric coatings of different composition;
metallization of the dielectric coatings;
overmolding the die assembly; and
removing at least part of the temporary workpiece and/or at least part of the overmold to expose the attached pads for connecting to a printed circuit board or another substrate.

8. The method of claim 7 , wherein at least part of the temporary workpiece and/or of the overmold is removed by etching, by grinding, and/or by polishing.

9. The method of claim 7 , wherein individual dies and their connected leads are singulated and readied for connection to a substrate like a printed circuit board.

Assignees

• Rosenberger Hochfrequenztechnik Gmbh & Co Kg

Inventors

• Cahill Sean S
• Sanjuan Eric A

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07552

  changes in structures or sizes · CPC title

• H10W72/07504

  the auxiliary member being temporary, e.g. a sacrificial coating · CPC title