Method of manufacturing a semiconductor package having conductive pillars
US-2024387343-A1 · Nov 21, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/145 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 710 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 36 |
| 2017 | 54 |
| 2018 | 54 |
| 2019 | 76 |
| 2020 | 92 |
| 2021 | 77 |
| 2022 | 75 |
| 2023 | 66 |
| 2024 | 74 |
| 2025 | 71 |
| 2026 | 18 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor integrated circuit device
US-9818715-B2 · Nov 14, 2017 · US
Polyarylene polymers
US-9752051-B2 · Sep 5, 2017 · US
Semiconductor device and method of making wafer level chip scale package
US-9673093-B2 · Jun 6, 2017 · US
Semiconductor device and method of forming ultra high density embedded semiconductor die package
US-9627338-B2 · Apr 18, 2017 · US
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
US-9620437-B2 · Apr 11, 2017 · US
High density organic bridge device and method
US-9548264-B2 · Jan 17, 2017 · US
Electronic apparatus and method for fabricating the same
US-9530745-B2 · Dec 27, 2016 · US
Electronic component-mounted structure, IC card and COF package
US-9516749-B2 · Dec 6, 2016 · US
Semiconductor device and method for manufacturing the same
US-9508619-B2 · Nov 29, 2016 · US
Semiconductor package and method of manufacturing the same
US-9508565-B2 · Nov 29, 2016 · US
Wiring substrate and method of making wiring substrate
US-9497863-B2 · Nov 15, 2016 · US
Scalable fabrication techniques and circuit packaging devices
US-2016330837-A1 · Nov 10, 2016 · US
Electronic apparatus and method for fabricating the same
US-9490232-B2 · Nov 8, 2016 · US
Wiring substrate having a plurality of connection terminals and a filling member provided therebetween
US-9485853-B2 · Nov 1, 2016 · US
Carrier and method for fabricating coreless packaging substrate
US-9485863-B2 · Nov 1, 2016 · US
Package including a semiconductor die and a capacitive component
US-9478519-B2 · Oct 25, 2016 · US
Semiconductor device
US-2016284618-A1 · Sep 29, 2016 · US
Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the same
US-9437580-B1 · Sep 6, 2016 · US
Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers
US-9418877-B2 · Aug 16, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/145?
- CPC H01L23/145 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/145 (Electricity)?
- Our database includes 710 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/145 growing?
- Publication counts under this code: 74 in 2024 vs 71 in 2025 (latest complete years).