Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Electronic apparatus and method for fabricating the same
US9530745B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9530745-B2 |
| Application number | US-201615142690-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 29, 2016 |
| Priority date | Dec 9, 2013 |
| Publication date | Dec 27, 2016 |
| Grant date | Dec 27, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic apparatus comprising: a first electronic part with a first terminal; a second electronic part with a second terminal opposite the first terminal; and a joining portion including a first compound and a second compound, the first compound including an intermetallic compound containing a first element and a second element different from the first element, the first compound extending in a direction from the first terminal to the second terminal, the second compound containing the first element and the second element, the second compound joining the first terminal and the second terminal, the second compound being around the first compound; wherein the first element is Sn, the second element is Ag, and the intermetallic compound is Ag 3 Sn. 2. The electronic apparatus according to claim 1 further comprising a first member which is disposed over the first electronic part and which has first heat capacity. 3. The electronic apparatus according to claim 2 , wherein the first member is separate from the second electronic part. 4. The electronic apparatus according to claim 2 , wherein heat capacity of the first electronic part over which the first member is disposed is larger than heat capacity of the second electronic part.
Assignees
Inventors
Classifications
Encapsulations, e.g. protective coatings · CPC title
characterised by their materials · CPC title
characterised by their materials · CPC title
Die-attach connectors and bond wires · CPC title
Means for cooling · CPC title
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Frequently asked questions
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- What does patent US9530745B2 cover?
- An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joi…
- Who is the assignee on this patent?
- Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W72/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).