Electronic apparatus and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-9490232-B2
Application number	US-201414532032-A
Country	US
Kind code	B2
Filing date	Nov 4, 2014
Priority date	Dec 9, 2013
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

First claim

What is claimed is:

1. An electronic apparatus comprising:
a first electronic part with a first terminal;
a second electronic part with a second terminal opposite the first terminal; and
a joining portion which joins the first terminal and the second terminal and which includes a first pole-shaped compound of Ag 3 Sn extending in a direction in which the first terminal and the second terminal are opposite to each other;
wherein the joining portion includes a portion which covers the first pole-shaped compound of Ag 3 Sn, the portion including Sn and Ag.

2. The electronic apparatus according to claim 1 further comprising a first member which is disposed over the first electronic part and which has first heat capacity.

3. The electronic apparatus according to claim 2 , wherein the first member is separate from the second electronic part.

4. The electronic apparatus according to claim 2 , wherein heat capacity of the first electronic part over which the first member is disposed is larger than heat capacity of the second electronic part.

5. An electronic apparatus comprising:
a first electronic part with a first terminal;
a second electronic part with a second terminal opposite the first terminal; and
a joining portion which joins the first terminal and the second terminal and which includes a first pole-shaped compound of Ag 3 Sn extending in a direction in which the first terminal and the second terminal are opposite to each other;
wherein the joining portion includes a second pole-shaped compound extending in the direction in which the first terminal and the second terminal are opposite to each other, and a portion which covers the second pole-shaped compound, the portion including Sn and Ag, the second pole-shaped compound being an intermetallic compound including Sn and Ag.

6. The electronic apparatus according to claim 5 , wherein the second pole-shaped compound includes Ag 3 Sn.

7. The electronic apparatus according to claim 5 , further comprising a first member which is disposed over the first electronic part and which has first heat capacity.

8. The electronic apparatus according to claim 7 , wherein the first member is separate from the second electronic part.

9. The electronic apparatus according to claim 7 , wherein heat capacity of the first electronic part over which the first member is disposed is larger than heat capacity of the second electronic part.

Assignees

• Fujitsu Ltd

Inventors

• Shimizu Kozo
• Sakuyama Seiki

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W76/17

  characterised by their materials · CPC title

• H10W76/67

  characterised by their materials · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/07152

  Means for cooling · CPC title