Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the same

Patent metadata

Field	Value
Publication number	US-9437580-B1
Application number	US-201514835589-A
Country	US
Kind code	B1
Filing date	Aug 25, 2015
Priority date	Apr 13, 2015
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface, a first semiconductor chip connected to the first protrusion, a second semiconductor chip connected to the second protrusion, a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate, a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate, and an external connection terminal disposed on the second surface of the flexible package substrate.

First claim

What is claimed is:

1. A semiconductor package comprising:
a flexible package substrate including a first surface and a second surface;
a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface;
a first semiconductor chip connected to the first protrusion;
a second semiconductor chip connected to the second protrusion;
a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate;
a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate;
an external connection terminal disposed on the second surface of the flexible package substrate; and
a plurality of wiring patterns disposed in the flexible package substrate to connect the metal post to the external connection terminal.

2. The semiconductor package of claim 1 , wherein the flexible package substrate is an organic substrate including a flexible organic material or an insulation substrate including a flexible insulation material.

3. The semiconductor package of claim 2 , wherein the organic substrate includes at least one organic material selected from a group consisting of polymer resin, epoxy resin and plastic.

4. The semiconductor package of claim 1 , wherein the metal post is disposed to have a vertical pillar shape penetrating the flexible package substrate.

5. The semiconductor package of claim 1 , wherein the first semiconductor chip is connected and fixed to the first protrusion and the second semiconductor chip is connected and fixed to the second protrusion.

6. The semiconductor package of claim 1 ,
wherein the first semiconductor chip includes a first front side portion on which at least one first connection pad is disposed and a first back side portion which is opposite to the first front side portion;
wherein the second semiconductor chip includes a second front side portion on which at least one second connection pad is disposed and a second back side portion which is opposite to the second front side portion; and
wherein the first and second semiconductor chips are disposed so that the first and second connection pads face each other.

7. The semiconductor package of claim 6 ,
wherein the at least one first connection pad includes a plurality of first connection pads;
wherein the at least one second connection pad includes a plurality of second connection pads;
wherein the plurality of first connection pads are arrayed in at least two columns located at a central portion of the first front side portion of the first semiconductor chip; and
wherein the plurality of second connection pads are arrayed in at least two columns located at a central portion of the second front side portion of the second semiconductor chip.

8. The semiconductor package of claim 6 , wherein the at least one first connection pad is disposed to be vertically aligned with the at least one second connection pad so that the at least one first connection pad and the at least one second connection pad are symmetric with respect to the flexible package substrate.

9. The semiconductor package of claim 1 , wherein at least one of the first and second flexible molding members includes a flexible material having a Young's modulus of about 0.01 GPa to about 0.1 GPa.

10. The semiconductor package of claim 9 , wherein the flexible material includes silicone resin or silicone rubber.

11. The semiconductor package of claim 1 , wherein the first flexible molding member includes a flexible material that can be bent in response to an external force applied to the flexible package substrate.

12. The semiconductor package of claim 1 , wherein the second flexible molding member includes a flexible material that can be bent in response to an external force applied to the flexible package substrate.

13. The semiconductor package of claim 1 , wherein the first flexible molding member fully fills a space between the flexible package substrate and the first semiconductor chip which are spaced apart from each other by the first protrusion of the metal post.

14. The semiconductor package of claim 1 , wherein the second flexible molding member fully fills a space between the flexible package substrate and the second semiconductor chip which are spaced apart from each other by the second protrusion of the metal post.

Assignees

• Sk Hynix Inc

Inventors

• No Ga Hyun
• Jeong Chan Woo

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/24

  at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/856

  Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15) · CPC title