Adaptive capacitors with reduced variation in value and in-line methods for making same
US-2017338299-A1 · Nov 23, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L22/22 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 494 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 26 |
| 2017 | 40 |
| 2018 | 52 |
| 2019 | 51 |
| 2020 | 61 |
| 2021 | 56 |
| 2022 | 49 |
| 2023 | 35 |
| 2024 | 48 |
| 2025 | 37 |
| 2026 | 12 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and method of testing semiconductor device
US-9823291-B2 · Nov 21, 2017 · US
Semiconductor device
US-9754877-B2 · Sep 5, 2017 · US
Semiconductor device and method of testing semiconductor device
US-9746878-B2 · Aug 29, 2017 · US
Multi-orientation integrated cell, in particular input/output cell of an integrated circuit
US-9735772-B2 · Aug 15, 2017 · US
Wafer arrangement, a method for testing a wafer, and a method for processing a wafer
US-2017213773-A1 · Jul 27, 2017 · US
Multi-dimensional integrated circuit structures and methods of forming the same
US-9686852-B2 · Jun 20, 2017 · US
Implementing resistance defect performance mitigation using test signature directed self heating and increased voltage
US-2016379898-A1 · Dec 29, 2016 · US
Implementing resistance defect performance mitigation using test signature directed self heating and increased voltage
US-2016379899-A1 · Dec 29, 2016 · US
Integrated circuit having main route and detour route for signal transmission and integrated circuit package including the same
US-9524922-B2 · Dec 20, 2016 · US
Light emitting diode display device and manufacturing method thereof
US-2016351457-A1 · Dec 1, 2016 · US
Electrical component testing in stacked semiconductor arrangement
US-9502315-B2 · Nov 22, 2016 · US
Light emitting device and manufacturing method thereof
US-9490184-B2 · Nov 8, 2016 · US
Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
US-9484323-B2 · Nov 1, 2016 · US
Fault tolerant design for large area nitride semiconductor devices
US-2016284829-A1 · Sep 29, 2016 · US
Semiconductor apparatus having TSV and testing method thereof
US-9455190-B2 · Sep 27, 2016 · US
Bypass capacitor circuit and method of providing a bypass capacitance for an integrated circuit die
US-9431338-B2 · Aug 30, 2016 · US
Yield enhancing vertical redundancy method for 3D wafer level packaged (WLP) integrated circuit systems
US-9425110-B1 · Aug 23, 2016 · US
Apparatus and methods for through substrate via test
US-2016233136-A1 · Aug 11, 2016 · US
Aggregation of semiconductor devices and the method thereof
US-9397275-B2 · Jul 19, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L22/22?
- CPC H01L22/22 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L22/22 (Electricity)?
- Our database includes 494 publications tagged with this CPC code.
- Is patent activity under CPC H01L22/22 growing?
- Publication counts under this code: 48 in 2024 vs 37 in 2025 (latest complete years).