Light emitting device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9490184-B2
Application number	US-201514802095-A
Country	US
Kind code	B2
Filing date	Jul 17, 2015
Priority date	Dec 28, 2012
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains alter removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.

First claim

What is claim is:

1. A light-emitting device comprising:
a substrate including one or more wiring patterns provided thereon;
a trace of a defective element provided on one of the one or more wiring patterns, wherein the trace is a die bonding mark, a die bonding material residue, a wire bonding mark, and/or a wire residue;
a plurality of light-emitting elements provided on the one or more wiring patterns, wherein the plurality of light-emitting elements includes a replacement light-emitting element mounted on the same wiring pattern on which the trace of the defective element is provided;
a reflective member covering at least a part of the trace of the defective element; and
a sealing member covering the replacement light-emitting element and at least a part of the reflective member covering at least a part of the trace of the defective element.

2. The light-emitting device according to claim 1 , wherein a part the reflective member is provided under at least a part of the replacement light-emitting element.

3. The light-emitting device according to claim 1 , wherein the reflective member is a white member.

4. The light-emitting device according to claim 1 , wherein the plurality of light-emitting elements is ultrasonic-mounted on the one or more wiring patterns in accordance with a flip-chip scheme.

5. The light-emitting device according to claim 1 , wherein the sealing member is selected from the group consisting of epoxy resin, silicone resin, or modified epoxy resin and modified silicone resin.

6. The light-emitting device according to claim 1 , wherein the reflective member comprises a silicone resin, a modified silicone resin or a resist containing a material selected from the group consisting of titanium oxide, silicon oxide, barium sulfate, aluminum oxide, and a wavelength conversion member.

7. The light-emitting device according to claim 1 , wherein the reflective member comprises an insulating resin containing a white filler or white powder and having a property of high reflectance.

8. The light-emitting device according to claim 1 , wherein the reflective member is disposed so that at least a part of the replacement light emitting element is exposed from the reflective member.

9. The light-emitting device according to claim 1 , wherein at least a part of a top surface and a side surface of the replacement light emitting element is exposed from.

10. The light-emitting device according to claim 1 , wherein the defective element is an element that is not properly connected to the one or more wiring patterns. the reflective member.

11. A method for manufacturing a light-emitting device, comprising the steps of:
mounting a plurality of light-emitting elements on one or more wiring patterns on a substrate;
determining that at least one of plurality of light-emitting elements is defective; and then
removing the defective element of the plurality of light-emitting elements, leaving a trace of the defective element on one of the one or more wiring patterns, wherein the trace is a die bonding mark, a die bonding material residue, a wire bonding mark, and/or a wire residue;
mounting a replacement light-emitting element on the same wiring pattern on which the trace of the defective element is provided;
covering at least part of the trace of the defective element with a reflective member; and
sealing the replacement light-emitting element and at least a part of the reflective member covering at least a part of the trace of the defective element with a sealing member.

12. The method for manufacturing a light-emitting device according to claim 11 , wherein a part the reflective member is provided under at least a part of the replacement light-emitting element.

13. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member is a white member.

14. The method for manufacturing a light-emitting device according to claim 11 , wherein the plurality of light-emitting elements is ultrasonic-mounted on the one or more wiring patterns in accordance with a flip-chip scheme.

15. The method for manufacturing a light-emitting device according to claim 11 , wherein the sealing member is selected from the group consisting of epoxy resin, silicone resin, or modified epoxy resin and modified silicone resin.

16. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member comprises a silicone resin, a modified silicone resin or a resist containing a material selected from the group consisting of titanium oxide, silicon oxide, barium sulfate, aluminum oxide, and a wavelength conversion member.

17. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member comprises an insulating resin containing a white filler or white powder and having a property of high reflectance.

18. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member is disposed so that at least a part of the replacement light emitting element is exposed from the reflective member.

19. The method for manufacturing a light-emitting device according to claim 11 , wherein at least a part of a top surface and a side surface of the replacement light emitting element is exposed from the reflective member.

20. The method for manufacturing a light-emitting device according to claim 11 , wherein the step of mounting the plurality of light-emitting elements on one or more wiring patterns on the substrate comprises providing a reflective material layer on the one or more wiring patterns on the substrate, the reflective material layer having openings exposing the one or more wiring patterns, a size of each of the openings allowing about two light-emitting elements to be mounted in each of the openings on the one or more wiring patterns on the substrate, and mounting one light-emitting element in each of the openings.

21. The method for manufacturing a light-emitting device according to claim 11 , wherein the defective element is an element that is not properly connected to the one or more wiring patterns.

Assignees

• Nichia Corp

Inventors

• Miyata Tadaaki

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P74/232 Primary

  comprising connection or disconnection of parts of a device in response to a measurement · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K3/225

  Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence) · CPC title