Multi-dimensional integrated circuit structures and methods of forming the same

Patent metadata

Field	Value
Publication number	US-9686852-B2
Application number	US-201514680822-A
Country	US
Kind code	B2
Filing date	Apr 7, 2015
Priority date	Jan 20, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.

First claim

What is claimed is:

1. A structure comprising:
a first interposer;
a first die and a second die each being attached to a first side of the first interposer using first conductive connectors, second conductive connectors being on respective sides of the first die and second die opposite from the first conductive connectors;
a third die and a fourth die each being attached to a second side of the first interposer using third conductive connectors, the second side of the first interposer being opposite from the first side of the first interposer;
a second interposer, the first die and the second die each being attached to a first side of the second interposer using the second conductive connectors; and
a substrate attached to a second side of the second interposer using fourth conductive connectors, the second side of the second interposer being opposite from the first side of the second interposer.

2. The structure of claim 1 , wherein the first die is communicatively coupled to the second die through the first interposer, and/or the third die is communicatively coupled to the fourth die through the first interposer.

3. The structure of claim 1 , wherein at least one of the first die, the second die, the third die, and the fourth die is redundant of another one of the first die, the second die, the third die, and the fourth die.

4. The structure of claim 1 , wherein the interposer comprises a multiplexor capable of receiving respective signals from at least two of the first die, the second die, the third die, or the fourth die and selectively sending a selected signal.

5. The structure of claim 1 , wherein at least one of the first die, the second die, the third die, or the fourth die comprises a multiplexor capable of receiving respective signals from at least two others of the first die, the second die, the third die, or the fourth die.

6. The structure of claim 1 , wherein fifth conductive connectors are on a side of the third die opposite from the third conductive connectors, a wire being attached to the substrate and at least one of the fifth conductive connectors.

7. The structure of claim 1 , wherein fifth conductive connectors are on a side of the third die opposite from the third conductive connectors, a wire being attached to the second side of the first interposer and at least one of the fifth conductive connectors.

8. The structure of claim 1 , wherein fifth conductive connectors are on a side of the third die opposite from the third conductive connectors, a wire being attached to at least one of the fifth conductive connectors and at least one of the first conductive connectors.

9. The structure of claim 1 further comprising a wire attached to the first side of the first interposer and at least one of the first conductive connectors.

10. The structure of claim 1 , further comprising a third interposer attached to the third die using fifth conductive connectors, wherein the fifth conductive connectors are on a side of the third die opposite from the third conductive connectors.

11. A structure comprising:
a first interposer;
a first die and a second die each being attached to a first side of the first interposer using first conductive connectors; and
a second interposer, the first die and the second die each being attached to a first side of the second interposer using second conductive connectors, the second conductive connectors being on respective sides of the first die and second die opposite from the first conductive connectors, wherein a second side of the second interposer opposite the first side of the second interposer is free of attached dies.

12. The structure of claim 11 further comprising a third die and a fourth die each being attached to a second side of the first interposer using third conductive connectors, the second side of the first interposer being opposite from the first side of the first interposer.

13. The structure of claim 11 further comprising a substrate attached to a second side of the first interposer using third conductive connectors, the second side of the first interposer being opposite from the first side of the first interposer.

14. The structure of claim 13 , further comprising fourth conductive connectors attached to a side of the substrate opposite the first interposer.

15. The structure of claim 11 , wherein the first die is communicatively coupled to the second die through the first interposer and/or the second interposer.

16. The structure of claim 11 , wherein the first die is redundant of the second die.

17. A method comprising:
attaching a first die and a second die to a first side of a first interposer using first conductive connectors;
attaching the first die and the second die to a first side of a second interposer using second conductive connectors, the second conductive connectors being on respective sides of the first die and second die opposite from the first conductive connectors; and
attaching a substrate to a second side of the first interposer using third conductive connectors, the second side of the first interposer being opposite from the first side of the first interposer.

18. The method of claim 17 , wherein the first die is communicatively coupled to the second die through the first interposer and/or the second interposer.

19. The method of claim 17 , wherein the first die is redundant of the second die.

20. The method of claim 17 , further comprising attaching a third die to the first side of the first interposer using fourth conductive connectors.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semicondcutor Mfg Company Ltd

Inventors

• Semmelmeyer Mark
• Goel Sandeep Kumar

Classifications

• H10W90/293

  characterised by non-galvanic coupling between the chips, e.g. capacitive coupling · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W72/823

  Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip · CPC title